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摩尔定律的碎片  2009-05-13 12:23
摩尔定律还坚持着工艺每两年一个更新周期的发展规律,只是能够跟随这个规律的厂商已经变得越来越少。

更新周期概念本身也开始变得模糊。当英特尔努力探索32nm作为继45nm后的新一代技术时,台积电则把目光投向继40nm后的28nm技术。由于一些企业总是向着更深层面的技术革新发展,无形当中原本2年一次的工艺更新周期被延长。

企业内部亦是如此,厂商不清楚何时是酝酿下一个工艺革新的最佳时机。飞思卡尔,摩尔定律的坚实拥护者,最近也修改了自己遵循多年的发展计划,将2年一次的工艺革新规律运用在某些案列而非以往的全部。

“这是因为每个市场领域需求不同,”飞思卡尔CTO Lisa Su说道。“在网络领域,我们从90nm直接进入到45nm时代,省略了中间的65nm。汽车电子领域则不同,现在我们依然再推许多90nm工艺产品,并且计划发展65nm工艺。消费电子领域也很难跳过某个工艺革新。虽然,网络领域也很难跳跃某个工艺环节,但是我们还是这样做了,接下来的22nm会是更艰难的一项挑战。不过我认为省略某项工艺与其说是技术问题不如将其归为企业市场定位。”

注:每次工艺革新都意味着一定量的成本投入,在决定投资之前,厂商都会非常谨慎的考虑研发什么?什么时候研发?新出来的芯片将向何处销售以及是否有某个平台能够节省开支等问题。

“布线人员很高兴,因为他们已经解决了部分22nm工艺问题,但是这个过程依然很昂贵,”Su说。

简言之,由此带来的问题就是前期采用这项工艺的投资者他们将花费不菲。此外,由于工艺的不同产品产量也不尽相同,再加之技术复杂度的渐长,每一次工艺革新所需的成本也水涨船高。就22nm来说,台积电已经在探讨严格的设计规则,而IBM则在考虑是不是通过减少部分功能节约能耗,提高性能。英特尔称自己已经全面进入22nm工艺制程,但是在该工艺下它的处理器中会有什么呢?我们还没有得到准确答案。

甚至FPGA领域厂商也在调整自己的战略。之前主攻130nm工艺的Actel已经将65nm最为下一代发展重点。Actel市场营销副总Rich Kapusta说之所以做出这样的决定是因为65nm制程已经相对成熟,费用较低。

平台,IP及其他战略


出现在飞思卡尔和Actel公司的变化也正发生在其他许多公司内部。成本vs.产量vs.市场机遇已成各家公司制定发展计划的不二法宝。例如,有些积极进行工艺革新的厂商可能花费在每次革新时的时间较长,有些则在完全有必要跟进的时候再发力,然后依然保持与已经成熟顶尖工艺一步之遥。

平台是另一个需要认真考虑的因素。2003年,英特尔在证实使用多时钟的单核处理器无效后推出了自己首个面向笔记本电脑平台用的Centrino处理器产品链路。现在,相同的方式被广泛应用在芯片以及设计这些芯片的模型当中。Mentor、Synopsys在平台领域都积极推陈出新,IBM,三星以及特许半导体甚至还联手推出了一项通用生产平台。

所有这些事例的目的都是在完成新品设计收支平衡后还能够走的更远。IP认证是另一个符合当前半导体产业发展的方式,不过所有的设计都需要IP认证,因为一个平台并不能完成所有由当前设计衍生而来的变革品种。

EDA和设计服务营销资深主管Tom Quan说摩尔定律已经过时了,这个描述工艺变革的巨大钟型曲线在设计成本、设计复杂度以及使非经常性工程师获得经验等因素的影响下已经发生了改变。虽然截至目前产业总的设计人数没有发生显著变化,特别是在SoC领域,但是在某些先进工艺研发领域这个数量正在被悄悄改写。

原文:

Moore’s Law Splinters

Moore’s Law continues progressing at a rate of one node every two years or so, but the number of companies that are adhering to that schedule is becoming much harder to pinpoint.

Even the nodes themselves are becoming fuzzy. While Intel is looking at 32nm as the next node after 45nm, TSMC is looking at 28nm as the next node after 40nm. And there are likely to be extensions within each node to allow some companies to stay on a process node a lot longer than before.

Even within companies, there is no clear answer about when to move to the next node. Freescale, which has been one of the die-hard adherents to the relentless schedule of Moore’s Law, has recently modified its stance. It follows the road map in some cases and not in others.

“It’s different by market,” said Lisa Su, Freescale’s chief technology officer. “In the networking market, we went from 90nm to 45nm. We skipped 65nm. In the automotive segment we won’t do that. We’re doing a lot of 90nm products now and will move to 65nm. In the consumer segment it is very hard to skip a node. If you’re in the networking segment, it’s hard to skip a node but we did it. 22nm is going to be extraordinarily tough. I think skipping nodes is more of a function of the market segment than the technology.”

Translation: It’s going to cost a bundle at each new node, and companies are thinking very hard about what should be migrated and when, where the various derivatives of those chips can be sold and whether a platform approach will work to save costs.

“The lithographers were happy that they got some of the issues solved (at 22nm), but it’s still going to be very expensive,” Su said.

Consider that an understatement. The common thinking these days is that for early adopters, the cost will be exorbitant. For one thing, yield will vary because of process variability, which is higher at each new node because of the complexity involved. At 22nm, foundries such as TSMC already are talking about restrictive design rules and IBM is debating whether to actually reduce some functionality at that node to save power and improve performance. Intel says it has 22nm well under way, but exactly what will be in its processors at that node has not been publicly disclosed.

Even the FPGA world is shifting its strategy. Actel, which has built much of its business at 130nm, is moving to 65nm as its next node. Rich Kapusta, Actel’s vice president of marketing and business development, said the reason to stop there is that the 65nm process for that node is already well tested and variability is low.
Platforms, IP and other strategies

What is happening at Freescale and Actel is happening in many other companies, as well. Decisions about cost vs. yield vs. market opportunity are being discussed everywhere. In some cases, companies decide to move to the next process node but stay at each node longer. In others, they wait until it is absolutely necessary to move to the next node, and then remain one step behind the bleeding edge where the processes are already mature.

Platforms are another strategy that has crept into discussions. Intel adopted its first platform when it introduced its Centrino line of processors for laptop computers in 2003 after deciding that multiple iterations of a single processor using different clock speeds was inefficient. That same approach is now being applied to both chips and the models being used to design those chips. Both Mentor Graphics and Synopsys are pushing platforms, and IBM, Samsung and Chartered Semiconductor have teamed up to create the Common Platform for manufacturing.

The goal in each of these cases is to make work go farther than one design to amortize some of the architectural and design costs. Validated IP is another strategy that fits into that scenario. And while all designs still need to be verified, with a platform approach not all of the design has to be verified for each iteration or derivative.

Tom Quan, senior director of EDA and design service marketing, said Moore’s Law is flattening. The giant bell curve approach to a process node is changing to reflect runaway costs and complexity and the ability to recoup non-recurring engineering expenses. And while the overall number of designs may not change significantly, particularly in the SoC realm, the number at the most advanced process nodes has already changed.

原文链接:
http://chipdesignmag.com/sld/blog/2009/04/28/moore%E2%80%99s-law-splinters/
作者:Ed Sperling,编译:与非网 周方
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