spartan3e的板子能用xps_ll_temac的软核么

spartan3e starter kit (type D) digilent官方出的开发板，xc3s500e的芯片，lan83c185-jt以太网物理层芯片，

BSB工程默认加载的是xps_ethernetlite的软核，精简版的MAC，

性能表现实在无法让我满意……

现在我想改用xps_ll_temac的软核实现100M以太网通信，

开发板现有硬件引脚布局可以实现么？

两个软核在性能上有什么差距？

如果可以实现的的话，引脚配置，约束方面能提供一些参考设计或者相关资料么。

主要是不知道哪些信号要引到外部引脚，和外设怎么连。

软件环境 EDK10.1.03

官方的文档说是支持的，但是只有spartan3a的相关信息，看了3天还是不懂，

文档的那些信号标号和工程IP核里得标号不一样，有谁做过相关实验的，出来帮帮忙啊，先谢过了。

I believe that there is no need to use TEMAC for 10/100M Ethernet port on Spartan3E Starter Kit.

What I think of the difference between TeMAC and EthernetLite is that the former is not free, but can support 1000M Ethernet, however the latter one is free, supports only 10/100M Ethernet. Moreover, TeMAC has DMA functionality for boards who has SDRAM available using MPMC.

 

Considering the performance, I think you should verify the cause. According to my experience, the bottleneck of the overall internet performance lies at the tcp/ip stack running on microblaze together with xilkernel. So, switching from ethernetlite to TeMAC will have no improvement on performance. If you want to reach full bandwidth, probably, you need a hardware based tcp/ip stack. Otherwise, the data transmission speed will be about 2MBytes per second at most.

非常感谢版主的帮助，我终于知道整个系统的瓶颈了。

如果我想要处理每秒10MByte以上的数据，需要用什么样的芯片或者开发板呢。

版主能否提供芯片选型上的帮助。

PS：工作原因，回复太晚了……