complex的博客

微电子所研制成功高性能Ku波段功率放大器模块      近日，微电子所在新型微波功率放大器模块研究领域获得突破性进展。中国科学院微电子研究所—四川龙瑞微电子联合实验联合研制成功的Ku波段功率放大器模块，在13.7-14.5GHz频率范围内，功率增益 ，输出峰值功率 ，总工作效率达到13.6%。该模块有效体积为 ，总体重量为 ，并且通过了严格的高低温可靠性测试，关键技术指标都达到了国内一流水平。     该模块采用结构简单并且可靠性高的平面微带线完成微波链路，有效减小了重量和体积。在机械结构上设...

阅读全文>>

好长时间没有更新Blog了，看paper看得满脑子都是VBIC了，今天灌一篇，说一下测试和建模。 S参数测试中的去嵌入问题，以前觉得挺高深的，但是实际做过之后也不觉得有多困难了--当然，如果精度要求很高的话就另当别论了。在画版图的时候，除了器件之外一般还要有用于去嵌入的Open和Short图形，Open图形用来去除寄生电容的影响，Short图形用来去除寄生电感和电阻的影响。去嵌入的一般步骤如下： （1）测量Open图形的Y参数[Yo]与Short图形的Y参数[Ys]； （2）用[Ys]减去[Yo]，得到：[Yso]=[Ys]-[Yo]； （3）将[Yso]换为Z参数[Zso]，得到互连线...

阅读全文>>

From: compoundsemiconductor.net The emerging market for so-called femtocells will explode over the next five years, providing a key new application for power amplifier (PA) components, and a likely boost for makers of GaAs devices. Reports from ABI Research, In-Stat and Wintergreen Research all predict a sharp increase in deployments of femtocells, with accompanying demand for the various semiconductor components that they require. Femtocells, which are miniature cellular base stations, are ...

阅读全文>>

From: compoundsemiconductor.net RF Micro Devices is to cease development of transceivers for next-generation handsets and sell off its GPS solutions business, reducing its headcount by 350 employees. The GaAs chip maker estimates that the move will save it $75 million annually, largely from the decision not to plow research resources into development for broadband wireless transmission protocols, like wideband CDMA, Long-Term Evolution (LTE) and WiMAX. Although the move will cost $40 million...

阅读全文>>

Skyworks attributes part of its recent success to strategically developing its business with specific partners, like acquiring a supply deal with Blackberry manufacturer Research in Motion through its purchase of Freescale’s GaAs handset PA business. Although Sony-Ericsson, Motorola and Samsung each account for more than 10 percent of Skyworks' business, the company is also in the middle of a major ramp for wideband-CDMA PAs for Nokia. It claims to be the only PA maker that sells products...

阅读全文>>

我们开发的4英寸InGaP/GaAs HBT MMIC工艺流程。每一个步骤都有大量的实验和数据支持，已经非常成熟。 A. 制作对准标记。溅射金属Ti/W。在溅射金属之前，要用酸性腐蚀液对4 英寸外延片表面进行处理，否则标记金属容易起皱脱落。另外，在后面的工艺步骤中要注意对标记进行保护。 B.  蒸发发射极金属Ti/Pt/Au，Ti，Pt 和Au 分别为黏附层、阻挡层、导电层。InGaAs 和金属之间的接触势垒非常低，只要金属能和半导体良好浸润，紧密接触，就能形成欧姆接触，属于非合金欧姆接触。同时此金属将作为发射极腐蚀的掩膜。 C. 发射极台面腐蚀。...

阅读全文>>

  HBT、HEMT是微波毫米波领域中非常重要的高速固态器件，其中HBT由于具有功率密度和增益高、相位噪声低、线性度好、单电源工作、芯片面积小和价格性能比低等特点，已经逐步发展为MMIC领域中一个非常有竞争力的技术。目前，HBT已被广泛应用于高速光通信系统，如光调制驱动电路、时钟提取、数据恢复、MUX/DEMUX和光接收机电路。 HBT与HEMT比较，具有以下几个方面的优势： （1）HBT是一种电流方向垂直于器件表面的双极型器件，器件速度由外延层的厚度和掺杂水平决定。目前采用先进的外延生长技术（MBE和MOCVD）能够生长单原子层精...

阅读全文>>

The evolution of GaAs into an alternative to silicon in memory technology has progressed a step further, with BAE Systems making an investment in Micromem. The defense contractor is now assessing Micromem’s technology in its Nashua, New Hampshire, 6-inch GaAs fab for memory and detection applications. According to Steven Van Fleet, a director at Micromem, BAE Systems will have decided production plans for the technology by summer 2008. At this point BAE will return to follow up its investme...

阅读全文>>

Originally, pulsed-RF test systems were needed to test devices opearting at power levels higher than those which could be continuously tolerated without destruction of the devices, such as occur in radar systems. Subsequently, pulsed measurements were used simply to measure device parameters at anticipated signal levels to assist in the design of circuits for pulsed operation. More recently, pulsed measurements have been used to characterise devices to assist in devising and subsequently fitting...

阅读全文>>

Compound semiconductors are critical to the operation of many electronic and optoelectronic systems including mobile telephony systems, satellite communications and power systems, automotive applications, and more. Because of its unique properties, compound semiconductors have emerged as key enabling materials in facilitating the dramatic advancements and improvements in these industries. Unlike silicon, which is a single element semiconductor and, therefore, has a fixed set of inherent electro...

阅读全文>>

The transition from to mesa device topology was motivated by the following issues with the transferred substrate process. The dominate failure mechanism associated with the TS-process have to do with the substrate removal steps. After the device and circuit formation is complete, BCB coasts the wafer and vias are etched for the subsequent electroplating of a 5um thick ground plane. At this point a GaAS or AlN carrier wafer was soldered against the ground plane. Often the BCB cracks because of...

阅读全文>>

Field programmable analog arrays (FPAAs) Full-custom analog design of integrated circuits is time-consuming and their verification expensive. Many attempts have been made to apply rapid-prototyping techniques known from the digital domain to analog designs. The goal of the presented work is to develop an FPAA, which is suitable for reconfigurable implementation of analog continuous-time (CT) high-frequency filters on an integrated circuit. This would enable designers to immediately verify th...

阅读全文>>

From EETChina.com 事实上， TI在2008年已做好准备向竞争对手重新发动攻击，尤其是针对它的“眼中钉”：无晶圆厂竞争对手博通、MTK和高通。此外，数家集成器件制造商(IDM)，如飞思卡尔、英飞凌、NEC、NXP和意法半导体，也将同时角逐基带芯片市场。 TI准备推出新的芯片系列来迎战，逐渐展开其“混合”或轻晶圆厂制造策略，并向新的研发模式转型。这些举措中的一部分旨在降低制造成本，使公司成为更具应变能力的竞争者。 此外，TI似乎已经改变了它在逻辑器件(包括基带器件)方面的策略基调。曾几何时，这家芯片厂商还在大肆吹捧其先进的逻...

阅读全文>>

From compoundsemiconductor.net It's the simple goals that tend to capture our imagination, such as the breaking of the four-minute mile and the first ascent of Everest. In our community we also have a similar goal – the building of the first semiconductor chip that can operate at 1 THz. This target is particularly interesting because it is being attacked on two fronts by strikingly different technologies. Quantum cascade lasers (QCLs) are making gains from the optical side as researchers bu...

阅读全文>>

想想，你的手机可以将其中的Pic或者PPT投影到墙壁上，是多么炫！这就是所谓的Pico-projector，即皮投影仪。早就听闻了Ti的DLP(Dynamic Light Projection)技术--已在Barcelona展出，但是迟迟没有产品推出。这是一个诱人的市场，可以由于成本的原因，还没有成熟到可以推到市场。不过，那个日子一定不远了。 说起光电技术，其实化合物半导体是很重要的角色。LED，光互连，激光--甚至激光驱动器，都有化合物半导体的影子。这个市场非常庞大，科研上前途也很光明，可惜呀--难言！ Luminus Devices' experience comes from its devel...

阅读全文>>