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2009年的最佳测试开始投票  2008-12-26 13:41

编者按:TMW每年一度的最佳测试又开始投票了,今年这些奖项分别会花落谁家?欢迎大家来说说自己心目中的最佳测试设备!值得一提的是,在示波器组里,获得提名的示波器都是具备了串行信号分析或者混合信号调试的功能,又或者二者兼而有之,这是示波器在功能上两个显著的趋势。除此之外,NI刚刚发布不久的wi-fi数据采集卡出现在数据采集提名中,这是NI的又一创新产品,我很看好。数表方面FLUKE是当之无愧的领导者,出现在提名中的产品是F287。该产品是具有数据记录功能的一款数表。测试相关开发和管理软件中,VEE PRO9.0出现在提名中,遗憾的是美国国家仪器没有软件被提名。然而东边不亮西边亮,NI的PXI射频模块在射频通用测试仪器中被提名。在便携式的无线综合测试设备中,艾法斯的3500A是在原来的3500上升级而来的,新的3500A改良了音频分析与操作,3500A提供了整合性的音频测试连接能力与一个简易的麦克风接口。Keithley与RS则没有产品被提名。

最佳测试提名:

 Test & Measurement World’s editors have combed through many deserving products, nominated by vendors, that were introduced between November 1, 2007, and October 31, 2008. Here, we present the finalists for the 2009 Best in Test awards and ask you to help us choose the best of the best. Visit www.tmworld.com/awards to cast your vote for your favorite product in each of the 15 categories. We will announce the category winners on April 1 at www.tmworld.com and in our April issue. The overall top vote getter will be declared the 2009 Test Product of the Year.

Read about the finalists for the 2009 Test of Time award.





 




Audio/video and multimedia

→ IxRave Service Validation Platform, Ixia
→ Multimedia Test System, VI Technology
→ PEVQ Analyzer, OPTICOM
→ WaveQoE Test Suite, VeriWave

Read more about them


Board and system test and configuration

→ Cover-Extend Technology, Agilent Technologies
→ Flashstream Flash Vector Programming System, BPM Microsystems
→ Flying Scorpion FLS900 Dx Flying Probe System, Acculogic
→ SigmaSure Process Flow Visualization Software, SigmaQuest
→ TS-375 Avionics Test Platform, Geotest—Marvin Test Systems

Read more about them


Boundary Scan

→ JT 37x7 Rack-Mountable Instrument, JTAG Technologies
→ onTAP Series 4000 Software Featuring ProScan, Flynn Systems
→ Remote Instrumentation Controller 1000, ASSET InterTech
→ ScanBox RM System, Acculogic
→ UltraTAP-BT Test Pod, Intellitech
→ VarioTAP Platform, GOEPEL electronic

Read more about them


Data acquisition

→ DAC5682Z Digital-to-Analog Converters, Texas Instruments
→ DNR-12-1G Ethernet I/O Rack, United Electronic Industries
→ TEMPpoint Temperature Measurement Instrument for Ethernet (LXI), Data Translation
→ USB-1616HS-BNC Multifunction Data Acquisition Device, Measurement Computing
→ Wi-Fi Data Acquisition Devices, National Instruments

Read more about them


EDA/DFx/Test data-analysis software

→ DFT MAX compression solution, Synopsys
→ Encounter True-Time ATPG, Cadence Design Systems
→ Global Test Operations Solution, OptimalTest
→ Solder Joint Built-In Self-Test Software, Ridgetop Group

Read more about them


General-purpose instruments (non-oscilloscopes)

→ 287 True-rms Electronics Logging Multimeter, Fluke
→ 86108A Precision Waveform Analyzer, Agilent Technologies
→ DPP12500A-4T 12.5 Gbps 4 Tap Digital Pre-emphasis Processor, Synthesys Research
→ NSG 3060 Immunity Pulse Testing System, Teseq
→ Precision Resistor Module Family, Pickering Interfaces
→ U1253A Handheld Digital Multimeter with OLED Display, Agilent Technologies

Read more about them


Machine vision and inspection

→ sprint Color Cameras, Basler Vision Technologies
→ Genie GigE Vision-compliant Cameras, DALSA
→ In-Motion Measurement for WYKO 9000 Optical Profilers, Veeco Instruments
→ MV-7L In-line AOI System, MIRTEC
→ OptiCon TurboLine AOI System, GOEPEL electronic

Read more about them

Network physical-layer test

→ 100GbE Development Accelerator System, Ixia
→ AXS-635 Triple-Play Test Set, EXFO
→ MW90010A Coherent OTDR, Anritsu Company
→ Precision Reflectometer 4400, Luna Technologies

Read more about them


 

Oscilloscopes

→ DLM2000, Yokogawa
→ DPO3000, Tektronix
→ InfiniiVision 7000 Series, Agilent Technologies
→ M-Class, ZTEC Instruments
→ PicoScope 9201, Pico Technology
→ WavePro 7 Zi Series, LeCroy Corporation

Read more about them


Protocol analyzers

→ IxYukon Load Module, Ixia
→ N5309A-COM Compliance Assured Test Package, Agilent Technologies
→ TestCenter 3000 Series Module, Spirent Communications
→ Xgig FCoE Test Platform, Finisar

Read more about them


RF/microwave instruments: Application/standard specific

→ 3500A Portable Radio Communications Test Set, Aeroflex
→ BTS Master and Spectrum Master Analyzers, Anritsu Company
→ DigRF V4 Exerciser/Analyzer, Agilent Technologies
→ IQultra UWB Test System, LitePoint
→ URT Record & Playback System 4.0, Averna

Read more about them


RF/microwave instruments: General purpose

→ 6.6 GHz PXI Express RF Modular Instruments, National Instruments
→ GT-1000A Microwave Power Amplifier, Giga-tronics
→ Model 1830A RF Power Meter, TEGAM
→ R&S FSV Signal and Spectrum Analyzer, Rohde & Schwarz
→ SA2600 Handheld Real-Time Spectrum Analyzer, Tektronix

Read more about them


Semiconductor test

→ Automated Contact Resistance Socket Tester (CR-2600), Antares Advanced Test Technologies
→ EDGE Flicker Noise Measurement System, Cascade Microtech
→ MT2168 Pick and Place Service, Multitest elektronische Systeme
→ Protocol Aware Test System, Konrad
→ Turnkey RF Test Cell, Advantest
→ UltraWave 12G Test Instrument, Teradyne

Read more about them


Test accessories and interconnects

→ Edge 400a Series Contactors, Johnstech International
→ Gemini Kelvin Spring Pins, Everett Charles
→ Lead Free Test Probes, Interconnect Devices
→ Synergetix Dyno Test Socket for QFN Devices, Interconnect Devices
→ Ultra High Density (UHD) Interconnect Builder, W.L. Gore & Associates
→ W2630A Series DDR2 and DDR3 BGA Probes, Agilent Technologies

Read more about them


Test-development and test-management software

→ Arendar 2009 Suite, VI Technology
→ Simics 4.0, Virtutech
→ TestShell 2.2, QualiSystems
→ UPC Manager, Pacific Power Source
→ VEE Pro 9.0, Agilent Technologies

Read more about them


最快测试时间提名

Inaugurated in 2005, the annual Test of Time award honors a test, measurement, or inspection product that has provided state-of-the-art service for at least five years after its introduction.

In previous years, the editors of Test & Measurement World selected the award winner from the nominations we received from vendors. This year, we are inviting readers to help us select the winner.

Below, we present the six finalists that we chose from the numerous products that were nominated by their vendors. Read about each product and then cast your ballot for the one you think is deserving of the Test of Time award. The winner, which will be decided by a vote of our readers and our editors, will be announced on April 1 on www.tmworld.com and in our April 2009 issue.

ATEasy Test Executive and Development Environment, Geotest—Marvin Test Systems
Medalist 5DX Automated X-Ray Inspection System, Agilent Technologies
Pad ROL 100 Series Test Contactor, Johnstech International
PhaseFlex Microwave/RF Test Assemblies, W.L. Gore & Associates
TDS3000 Series Oscilloscopes, Tektronix
TestKompress ATPG Tool, Mentor Graphics


ATEasy Test Executive and Development Environment
Geotest—Marvin Test Systems
www.geotestinc.com

Introduced in 1991, ATEasy was designed to help users develop and maintain functional test applications. The software offers the capabilities of both a test executive and test-development tool set within a single, integrated environment. ATEasy provides a rapid application-development environment by employing JIT (just in time) compilation methods (similar to Java implementation), a feature that Geotest says was innovative when the product was introduced. Its open architecture supports a broad range of software and hardware tools and standards including .NET, ActiveX/COM, .DLL, IVI, function panel drivers, and LabView.

The software permits the development of programs that are self-documenting in a format that is similar to a test requirements document (TRD), so users can focus on the application, rather than on the tools needed to develop the application. In addition, ATEasy offers an integrated debug environment, allowing users to easily debug code at the application level or at the test step level.

Now in its 7th generation, the product started out running under Windows 3.0 and has been continually enhanced. It currently operates with Vista, XP, Me, and Windows 98 operating systems.


Medalist 5DX Automated X-Ray Inspection System
Agilent Technologies
www.agilent.com

Agilent says that, for over a decade, the Medalist 5DX has been the de facto standard for 3-D x-ray inspection, as it detects defects that no other test or inspection technique can find. In a study of more than 3 billion solder joints, the 5DX was able to detect 90% of all manufacturing-process-related defects. Without the use of the 5DX for medium-to-high-complexity boards, Agilent says, 50% of all defects are shipped to the end customer, in some cases turning into field failures and warranty returns. Additionally, the 5DX with its and 3-D automated x-ray inspection is able to automatically detect obscured solder-joint defects in electronics manufacturing. 

Since the introduction of the 5DX Series I in 1996, the 5DX series has undergone constant evolution.  As electronics technology continues to change through miniaturization, increasing density, and limited visual and electrical access for traditional test techniques, the 5DX product line has similarly advanced. Three primary areas of innovation have been the focus: increasing defect detection capabilities, improving throughput, and reducing cost and ease of implementation.


Pad ROL 100 Series Test Contactor
Johnstech International
www.johnstech.com

The Pad ROL100 Series has consistently offered high electrical performance for the testing of QFN, DFN, and other pad-style devices. In many high-frequency devices, it is important to have the lowest inductance possible between the device and the load board to avoid degrading the device’s electrical performance. The Pad ROL 100 delivers 40+ GHz of bandwidth with an exceptionally low ground inductance, and it permits users to test at significantly higher bandwidths then other products, according to Johnstech.

Using Johnstech’s patented technology, the Pad ROL 100 Series provides optimized electrical performance and proven mechanical reliability on both exposed and recessed pads. The contacts were designed to create a “rolling” motion on the load board, minimizing load board wear for customers, and they have a self-cleaning wipe action that reduces oxides as the contact scrubs across the device pad.

With this contactor, a user can obtain repeatable results during the characterization phase that can be repeated once the product moves to production test. Since its introduction in 2003, the contactor has evolved from testing only lead-based devices to testing lead-free devices, which has allowed customers to test both matte tin and NiPdAu device types.


PhaseFlex Microwave/RF Test Assemblies
W.L. Gore & Associates
www.gore.com

Available with performance through 110 GHz, the PhaseFlex Microwave/RF Test Assemblies provide superior phase and amplitude stability with flexure over a wide temperature range. They offer phase matching with the capability to performance match two or more cable assemblies to less than 1 ps. As an example, when an assembly was bent 90 degrees around a 1-in. radius mandrel, the change was only 4.3 degrees and 0.05 dB at 110 GHz. When the assembly returned to its original configuration, phase and amplitude returned to their original values. As a result, repeatable measurements are achieved without needing to repeat time-consuming calibrations between measurements.

The rugged PhaseFlex assemblies, which were introduced in 2003, are crush and torque resistant, while still offering a flexible outer diameter of only 0.165-in. (nominal). Even with this small size, the assemblies are very low loss. Typical insertion loss for a 16 cm assembly at 110 GHz is 2.1 dB.

With virtually no springback, the PhaseFlex assemblies allow for easy test setup, and they minimize stresses on devices under test, probe tips, and adapters. They can be flexed, reformed, or repositioned while minimizing the chance of damaging the assembly or test components.


TDS3000 Series Oscilloscopes
Tektronix
www.tektronix.com

With the introduction of the TDS3000 Series of oscilloscopes in 1994, powerful signal processing moved from the lab to the individual engineer’s bench. An analog bandwidth up to 500 MHz and sampling rates of up to 5 Gsamples/s still provide excellent fidelity for most applications. Its optional battery power and 7-lb weight make the instrument also suitable for the field.

This series brought Tektronix’ DPO (digital phosphor oscilloscope) technology into a small, portable instrument for the first time. DPO technology acquires thousands of waveforms per second and uses intensity grading to indicate how often a waveform occurs. Frequently occurring waveforms appear brighter than infrequent ones, making it easy to distinguish glitches, transients, and modulation. Once users see an anomaly, they can easily take a closer look with advanced glitch, runt pulse, or slew-rate triggers.

Optional software modules provide a scalable solution and support applications like limit testing, advanced channel math, telecom mask testing, and HDTV video. The TDS3000 Series has evolved and is currently known as TDS3000C. Improvements include the e*Scope built-in Web page server, WaveAlert automatic anomaly detection, and USB memory stick support.


TestKompress ATPG Tool
Mentor Graphics
www.mentor.com

The TestKompress ATPG (automatic test pattern generation) tool includes embedded test compression for delivering high-quality scan test while lowering cost. As test requirements grow, compression is needed to keep high-quality testing of ICs feasible within a high-throughput production environment. It simply isn't possible to apply tests vectors to an advanced technology IC without it.

With TestKompress, test access I/O can be reduced to three pins, thereby facilitating multisite testing, increasing device packaging options, and streamlining modular design techniques. Its EDT (Embedded Deterministic Test) technology gives consistent results for design types ranging from microprocessors to automotive electronics, without any loss of fault coverage.

TestKompress was introduced by adding pattern compression capability to the FastScan ATPG engine in 2001. Initial compression levels of 10X have evolved to levels exceeding 100X. Added features include distributed processing for faster execution and direct failure diagnosis without the need of special patterns. Designs can employ multiple compression levels so testing is optimized for wafer test, package test, and burn-in. A vectorless test, LBIST (logic built-in self-test), can be added to enable a thorough system test while the device is in the end-application.

Go to the ballot for the 2009 Test of Time award

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