Samtec提供最新56 Gbps PAM 4/112 Gbps PAM 4互连解决方案,DesignCon 2019

2019-01-29 07:41:00 来源:EEFOCUS
标签:
New Albany, IN:Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at DesignCon 2019 in Santa Clara, CA.
 
 
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects, 56 Gbps PAM4 and 112 Gbps PAM4 product demonstrations will also be highlighted. Samtec signal integrity experts will present papers, technical sessions, and tutorials on a variety of SI topics during the three-day conference.
 
Featured products and demonstrations at the Samtec booth include:
 
Products:
 
NovaRay: The innovative design of NovaRay combines extreme density and extreme performance for 112 Gbps PAM4 per channel, in 40% less space than traditional arrays, for an industry leading 4.0 Tbps aggregate data rate.
 
Samtec Flyover: As bandwidth requirements rapidly increase, routing signals through lossy PCBs, vias and other components has become one of the most complex challenges designers face. Samtec Flyover breaks the constraints of traditional substrate signaling and hardware offerings, resulting in a cost-effective, high-performance answer to the challenges of 112 Gbps bandwidth and beyond.
 
FQSFP-DD: Samtec was the first interconnect company to bring the QSFP Flyover product line to market. Samtec is excited to announce another first in the Flyover realm: Samtec’s FQSFP-DD is the first product to take the Samtec Flyover architecture concept to the QSFP-DD form factor.
 
AcceleRate®: Samtec’s AcceleRate® cable assembly is the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch.
 
Demonstrations:
 
112 Gbps PAM4 Flyover Cable Solution: Samtec’s NovaRay to ExaMAX® Cable Assembly offers new capability of 112 Gbps PAM4 while reducing the complexity and cost of high-performance PCB design.
 
56 Gbps PAM4 Active Product Demonstrator: The 56 Gbps PAM4 Active Product Demonstrator showcases Samtec’s comprehensive portfolio of high-performance interconnect in a typical data center chassis application.
 
112 Gbps PAM4 Samtec Flyover with QSFP-DD: Samtec’s FQSFP-DD to NovaRay Cable Assembly offers a high-density escape from the system ASIC to the front panel.
 
Samtec SI experts are also presenting in 10 Technical Sessions, Panel Discussions, and Tutorials. Here’s a link to Samtec’s Presentations at DesignCon 2019.
 
The products and demonstrations can be seen at Booth 737 at DesignCon 2019 at the at the Santa Clara (CA) Convention Center. The conference is January 29-31, and the exhibition is January 30-31.
 
For more information on the Samtec High-Performance Interconnect Portfolio, please visit www.samtec.com/s2s or e-mail SIG@samtec.com.
 
关注与非网微信 ( ee-focus )
限量版产业观察、行业动态、技术大餐每日推荐
享受快时代的精品慢阅读
 

 

继续阅读
安富利与Samtec扩大合作范围 携手开拓亚洲市场

全球领先的技术方案提供商安富利(纳斯达克股票代码:AVT)和全球著名的私营电子连接器制造商Samtec今日宣布,双方将加强现有的合作伙伴关系,进一步扩大分销合作范围。

Avnet将Samtec的专营权扩展至包括亚洲

Broadens global customer access and support to interconnect products

PLDA和Samtec演示了PCIe 4.0在Twinax电缆上的通信

PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cable Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost

贸泽与Samtec公司签署Mouser的全球分销协议

September 5, 2018 - Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic

Mouser与Samtec签署全球分销协议

Mouser Signs Global Distribution Agreement with Samtec

更多资讯
Navi GPU让AMD的好日子才刚刚开始?
Navi GPU让AMD的好日子才刚刚开始?

AMD将推出代号为Navi的GPU,并借此缩小和英伟达之间的差距;4.485亿美金的大规模现金注入将为其下一步研发活动和/或偿还部分债务提供有力的资金支撑

日本斥资12亿美元,将打造新一代国产超级计算机

要想高速、准确处理从各种事物收集到的庞大数据,离不开具有强大计算能力的设备,超级计算机就是支撑这一运算的技术之一。

科技巨头纷纷加码人工智能芯片布局,Facebook、亚马逊、谷歌竞争激烈

近年来,科技巨头们似乎都意识到了未来人工智能的激烈竞争,纷纷加码人工智能芯片布局。

2018年国内晶圆产线布局情况一览

2月19日,据芯思想研究院最新报告统计, 2018年内有关中国晶圆生产线的项目共46个,总投资金额高达14000亿人民币。

比特大陆第二代7nm芯片正式出炉,币圈寒冬不寒?
比特大陆第二代7nm芯片正式出炉,币圈寒冬不寒?

距离上一代7nm芯片发布不到半年,比特大陆第二代7nm芯片正式出炉,在币圈寒冬与众多谣言之中,这家低调的公司选择用实力说话。

电路方案