日前,Peregrine半导体在圣地亚哥宣布发布其基于Global Foundries(GloFo) 130nm 300mm工艺的射频SOI产品——UltraCMOS 11。

 

UltraCMOS 11技术采用Global Foundries位于新加坡的Fab 7工厂的定制化制造流程。

 

英文原文:

Peregrine Semiconductor of San Diego announces UltraCMOS 11 – an RF SOI technology built on GloFo’s’ 130nm 300mm RF process.

 

By moving to a 300mm wafer, Peregrine opens the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform.

 

UltraCMOS 11 technology uses a custom fabrication flow from GloFo’s’ Fab 7 in Singapore.

 

The UltraCMOS 11 platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications.

 

Peregrine writes:

The UltraCMOS 11 platform is the industry’s first RF SOI 300 mm technology platform.

Co-developed by GLOBALFOUNDRIES and Peregrine, it builds on the success of the award-wining UltraCMOS 10 platform and offers unparalleled performance and cost-competitive advantages. This customer-specific process uses a custom fabrication flow from GLOBALFOUNDRIES state-of-the-art Fab 7 facility in Singapore and will be the foundation for high volume mobile products and SOI product applications.

 

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