UltraCMOS 11技术采用Global Foundries位于新加坡的Fab 7工厂的定制化制造流程。
Peregrine Semiconductor of San Diego announces UltraCMOS 11 – an RF SOI technology built on GloFo’s’ 130nm 300mm RF process.
By moving to a 300mm wafer, Peregrine opens the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform.
UltraCMOS 11 technology uses a custom fabrication flow from GloFo’s’ Fab 7 in Singapore.
The UltraCMOS 11 platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications.
The UltraCMOS 11 platform is the industry’s first RF SOI 300 mm technology platform.
Co-developed by GLOBALFOUNDRIES and Peregrine, it builds on the success of the award-wining UltraCMOS 10 platform and offers unparalleled performance and cost-competitive advantages. This customer-specific process uses a custom fabrication flow from GLOBALFOUNDRIES state-of-the-art Fab 7 facility in Singapore and will be the foundation for high volume mobile products and SOI product applications.