From September 9 to 11, 2026, the IICIE International IC Innovation Expo (IC Innovation Expo) was held at the Shenzhen World Exhibition & Convention Center (Bao'an). Themed "Cross-boundary Integration, Full-chain Synergy, Building a Featured Chip Ecosystem Together", the event was co-located with CIOE China International Optoelectronic Expo and elexcon Shenzhen International Electronic & Embedded Exhibition. The three exhibitions combined featured a total exhibition area of 320,000 square meters and attracted over 5,000 participating companies. The expo set up exhibition zones for chips and chip design, wafer fabrication, packaging and testing, equipment, materials, and core components, covering the entire industrial chain of the IC (Integrated Circuit) industry.
01. Chip Design: The Main Arena for Computing Power
The chip design zone was one of the most densely populated areas in terms of participating companies at this expo. The exhibited products covered AI (Artificial Intelligence) computing power, automotive-grade chips, security chips, and edge SoC (System on Chip). Unigroup Guoxin brought security chips and automotive electronic solutions; Ingenic Semiconductor showcased edge AI processors covering AI wearables and smart vision; BYD Semiconductor entered the fray with automotive-grade power and autonomous driving chips. The layout of the design sector focusing on the two major applications of AI and automotive was clearly visible.
Unigroup Guoxin
#Unigroup Guoxin showcased its subsidiaries Ziguang Tongxin and Guoxin Jingyuan at this IICIE, and delivered keynote speeches at two core forums, sharing technical explorations and innovative practices in the fields of commercial aerospace and automotive electronics.
Ziguang Tongxin' booth was divided into two lines: security chips and automotive electronics. On the security chip side, eSIM products have shipped over 10 million units in global mobile phone scenarios, enabling the commercialization of China's first domestically produced eSIM chip mobile phone; security SE and security MCU (Microcontroller Unit) target consumer and industrial IoT (Internet of Things), and anti-counterfeiting authentication chips have been integrated into top-tier global OEMs, cumulatively serving tens of millions of terminals. On the automotive electronics side, automotive security chips have shipped over 10 million units, leading the domestic market share; automotive control chips have been mass-produced and applied in multiple automakers, and high-end automotive power domain MCU technology leads domestically, with power devices exhibited simultaneously.
Guoxin Jingyuan's three product series each have specific targets. The ultra-miniature series relies on fully automatic IN-LINE technology, achieving scaled mass production with a 4.5-generation fully automatic production line, targeting consumer electronics terminals such as smartphones, smart wearables, drones, and medical monitoring; the ultra-high-frequency series breaks through the Q-MEMS lithography process barriers, achieving domestic mass production of ultra-high-frequency fundamental frequency quartz crystal oscillators, targeting data centers, AI inference, servers, optical modules, satellite communications, and commercial aerospace; the ultra-stable series has passed the AEC-Q200/Q100 automotive-grade dual certification, covering the core control and communication fields of automotive electronics.
The most intuitive feeling from touring the exhibition is that both eSIM and automotive-grade security chips are backed by shipment data in the tens of millions, indicating that domestic automotive-grade chips are moving from single-product breakthroughs to scaled commercialization.
Ingenic Semiconductor
#Ingenic Semiconductor showcased its full range of computing chips, covering application directions such as AI wearables, AIoT, and smart vision.
CW080 is built for AI glasses, smart wearables, and micro vision terminals. It integrates a 1 TOPS@INT8 NPU in an ultra-small QFN90 package, supports 4K@30fps H.265 encoding, 12MP photography, and edge EIS anti-shake, and features built-in DDR. With a sleep power consumption of about 1mW and operating power consumption reduced by 30% compared to the previous generation, it is a wearable AI vision solution that balances performance and battery life. X3000 targets edge smart commercial and industrial applications. XBurst2, NPU, and Victory0 (RISC-V) form its computing core, combining edge AI and real-time control capabilities. X2600 and X1600 were exhibited simultaneously, covering the commercial and industrial multi-core heterogeneous and AIoT embedded markets, respectively. T33 is an SoC processor for smart vision applications, with a main frequency of 1.0GHz, supporting the Magik2.0 algorithm platform and 2880×1620 resolution, widely used in IPC cameras.
From AI glasses SoC to IPC main controllers, the full range of products is arranged in a gradient according to application scenarios. The landing path of edge AI chips is more informative than just looking at parameters.
BYD Semiconductor
#BYD Semiconductor showcased its core automotive-grade semiconductors, covering product lines such as IGBT, SiC power devices, BMS analog front-ends, and autonomous driving chips.
At the booth, the super trench gate automotive-grade IGBT chip IGBT8.0 adopts a new generation of independently developed ultra-fine trench technology. The ultra-deep sub-micron trench gate and ultra-high current density bring the industry's optimal turn-off loss. The ultra-large single-chip design enables a single chip current specification of up to 700A, with a 30% increase in driving power. The 305A SiC module is a 1200V automotive-grade power module, containing a self-developed SiC MOSFET chip. The double-sided silver sintering and stacked laser welding structure balance automotive-grade high reliability and extremely low parasitic inductance; the SiC wafer nearby is the highest voltage level product for the first time mass-produced in the field of automotive motor drive. The automotive-grade 4nm autonomous driving chip is equipped with a 16-core CPU, with a 20% lower power consumption per unit of computing power compared to similar products, a 100% increase in computing power utilization, and support for L3/L4 autonomous driving.
The exhibition focus is concentrated on mass production and vehicle installation. IGBT8.0, SiC wafers, and the 4nm autonomous driving chip all focus on "getting into vehicles," indicating that the competition for automotive-grade chips has entered the stage of mass production verification.
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02. Semiconductor Equipment: Deepening the Equipment Portfolio
The equipment exhibition zone was also a crowded area at the expo, covering process equipment such as thin film deposition, CMP polishing, ion implantation, bonding, and metrology & inspection. HWATSING brought CMP and ion implantation equipment, Piotech showcased thin film deposition and hybrid bonding equipment, and Jingce Electronic covered the complete process from wafer to chip with metrology and inspection equipment.
HWATSING
#HWATSING exhibited its full range of advanced semiconductor equipment and process integration solutions. A complete set of process equipment, including CMP machines, thinning and polishing integrated machines, and single-wafer cleaning machines, was all on display. Among them, two pieces of equipment for advanced processes are particularly worth a closer look.
The Universal-300FS CMP machine adopts a single-head and single-platen polishing system. The 8 independent pressure zone polishing heads integrate multiple real-time detection technologies. Combined with intelligent polishing pad conditioning, vertical scrubbing, and pull-up drying technologies, it achieves ultra-clean cleaning effects. Its applications cover logic chips, memory chips, Advanced Packaging, large silicon wafers, power devices, and image sensors. The iHQ-900E medium current ion implanter relies on an advanced triple-magnet architecture to achieve excellent ion beam angle accuracy and beam profile control, ensuring highly accurate wafer implantation doses. It is suitable for mass production processes of FinFET logic devices and memory chips such as DRAM and 3D NAND. Excellent metal contamination control meets the stringent requirements of CMOS image sensors, and the high-temperature implantation process module supports the doping process of SiC power devices.
From the category extension from CMP to ion implantation, it can be seen that domestic equipment companies are moving from single-point equipment to platform-based supply, and advanced process parameters have also become the core language of booth promotion.
Jingce Electronic
#Jingce Electronic showcased its full-field semiconductor metrology and inspection solutions, covering the complete industrial chain metrology and inspection from silicon wafers and wafers to chips.
On the advanced packaging production line, the Dolphin500 wafer defect inspection equipment is equipped with bright-field and dark-field and wide-band PL illumination systems. Traditional algorithms and AI algorithms work together to support efficient detection of homogeneous and heterogeneous integration, adapting to the mass production inspection needs of advanced packaging. Turning to memory testing, the JH8800 memory chip FT testing equipment adopts independently developed main control IP protocol boards and DSA adapter boards, supporting parallel testing of 512 eMMC/UFS/NAND DUTs, covering a wide temperature range of -40℃ to +125℃, with a significant improvement in testing efficiency. The 2D MEMS vertical probe card for AI computing power chips uses self-developed and self-produced 2D MEMS pins to achieve high-density, high-simultaneous testing, and high-frequency testing, with a maximum pin count of up to 40,000 pins. The JH59150A logic chip BI testing system, JHP580 bipolar pulse testing system, and PXle series high-precision digital source measure units were also exhibited on the same stage.
From wafer defect inspection to FT testing and then to probe cards, the localization puzzle in the metrology and inspection link is being completed piece by piece. The support of AI algorithms is also a common direction for multiple manufacturers at this exhibition.
Piotech
#Piotech showcased its 3D IC equipment technology achievements, demonstrating the breakthroughs of domestic equipment in advanced processes and advanced packaging.
The VS-300T Astra-s SiN focuses on the precision deposition of high-performance silicon nitride dielectric thin films. It targets processes such as advanced logic metal gate spacer sidewalls, single diffusion region isolation, memory bitline spacer sidewalls, and DRAM bitline filling. The intra-wafer uniformity, defect control, step coverage, and deposition rate reach international advanced levels, and the compact architecture can be equipped with 4 reaction chambers. PF-300T Flora is a flowable chemical vapor deposition equipment targeting tiny gaps such as high aspect ratio trenches. Through UV or vapor curing and oxidation treatment, it achieves void-free and seamless filling of structures with an aspect ratio of 8:1 or above, and has entered industrial application. The Pleione 300 HS chip-to-wafer hybrid bonding equipment for advanced packaging can directly bond at room temperature without bonding dielectrics or adhesives, and can select known good chips to participate in bonding to improve yield, applied in the field of compound semiconductor wafer reconstruction.
Seeing hybrid bonding equipment beyond traditional deposition equipment indicates that the tentacles of domestic equipment manufacturers have reached the forefront of advanced packaging. 3D IC is the next stop that no one can bypass.
03. Semiconductor Materials: The Material Cornerstone
The materials exhibition zone concentrated on displaying key materials such as electronic chemicals, sputtering targets, and CMP slurry. Xilong Scientific showcased its full range of wet electronic chemicals, Oulai New Materials exhibited sputtering targets and high-purity materials, and Anji Technology brought CMP slurry that has been mass-produced in mainstream processes. From the composition of the exhibits, the material supporting system in cleaning and etching, polishing and planarization, sputtering targets, and other links has formed a relatively complete supply system.
Xilong Scientific
#Xilong Scientific made its debut with a full lineup of wet electronic chemicals and supporting solutions. A large number of professional audiences in the fields of semiconductors, display panels, and ICs gathered in front of the booth. General-purpose wet electronic chemicals (sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, hydrofluoric acid, hydrogen peroxide, ammonia water, isopropanol, etc.), functional wet electronic chemicals (etchants, developers, strippers, diluents, cleaners), and other categories (n-heptane, n-hexane, dibutyl phthalate, 1,4-dioxane, etc.) were neatly displayed. The one-stop high-purity chemical solutions covering key processes such as cleaning, etching, and stripping attracted many customers to stop by. Xilong Scientific is an important enterprise in the field of domestic chemical reagents and wet electronic chemicals.
The competition for wet electronic chemicals lies in the completeness of categories and the ability of batch supply. The complete display from general-purpose to functional types reflects that the domestic substitution of materials in mature processes has become quite common.
Oulai New Materials
#Oulai New Materials took "Contributing High-end Materials to the IC Industry" as its exhibition theme, concentrating on displaying four major categories of core products. 12-inch copper (monomer), 12-inch titanium (monomer), aluminum, cobalt, phosphor copper, tantalum, tungsten-titanium, and other material products were displayed together; high-purity indium wire, high-purity indium foil, high-purity indium ball, liquid metal, and tantalum pentoxide formed a high-purity material matrix; tungsten parts, aluminum oxide, zirconium oxide, ceramic structural parts, and ceramic tubes were exhibited simultaneously. Oulai New Materials is an important enterprise in the domestic sputtering target field, and its products are widely used in high-end manufacturing fields such as semiconductors and display panels.
Putting sputtering targets, high-purity metals, and ceramic components on the same booth targets the integration of material supporting. Single-point material supply is turning into multi-category synergy.
Anji Technology
#Anji Technology's copper and copper barrier layer CMP slurry is used for the planarization of IC copper interconnects. It has been mass-produced and used in processes such as logic chips and memory chips, and products for the next-generation technology nodes are also under continuous R&D and verification. Anji Microelectronics Technology (Shanghai) Co., Ltd. establishes itself with technological innovation and intellectual property, adheres to the strategic positioning of "based in China, serving the world", and builds a "3+1" technology platform around the core technologies of micro-treatment technology for liquid and solid substrate surfaces and high-end chemical formulations, focusing on the best solutions for processes and materials in the chip manufacturing process.
Mass production and next-generation node verification are advancing simultaneously. Domestic material enterprises have entered the rhythm of following the iteration of advanced nodes, which is also the most noteworthy signal in the material link.
Seeing Industrial Signals Through the Booths
This expo attracted over 1,000 participating companies, covering the entire chain from chip design to core components. The exhibition scale in the equipment, materials, and components links has significantly increased; the format of the three exhibitions co-located allowed exhibitors and audiences in the fields of semiconductors, optoelectronics, and embedded electronics to communicate on the same stage.
From the overall perspective of the exhibition, several main threads run through multiple links.
1. AI computing power is the most intensive product direction at this expo, showing the characteristics of extending from data centers to the edge: the process and specifications of computing power chips continue to upgrade, the testing link evolves towards high density, high frequency, and high parallelism, advanced packaging has introduced new process options such as room temperature direct bonding, and peripheral devices such as crystal oscillators are simultaneously upgraded to high frequency and low jitter.
2. Automotive-grade semiconductors have entered a competition stage centered on mass production verification. The single-chip specifications and voltage levels of power devices continue to rise, SiC has landed in the field of motor drive, autonomous driving chips are advancing towards advanced processes, and automotive-grade certification has become a basic threshold.
3. The domestic substitution of equipment, materials, and components shows the characteristics of moving from single-point substitution to complete set supply: process equipment extends from single equipment to platform-based supply, materials shift from single-product supporting to multi-category combinations, and metrology and inspection cover the complete link from front-end to back-end.
The exhibition provides a window to observe the domestic semiconductor industrial chain. Through the booths, it can be seen that AI computing power and automotive-grade applications are the main threads running through multiple links, and the domestic supporting of equipment, materials, and components has initially taken shape; the focus of industry competition is shifting from product landing to mass production verification. Where it will go in the future is worth waiting and seeing.
Compiled by TrendForce Compound Semiconductor