Author: Xiao Meng TrendForce recently released the Top 10 Global Fabless Companies ranking for the second quarter of 2026, presenting a highly impactful report card to the industry. The list shows that the top ten fabless companies achieved a combined revenue of USD 141.45 billion, a year-on-year increase of 73%. While the 73% YoY growth rate is certainly eye-catching, it is merely an aggregate result. What deserves more attention than this figure is exactly who is growing, by how much, and wher
September 18, 2026
Every leap in optical interconnects is accompanied by the upgrading of high-speed optical modules—from 400G to 800G and then to 1.6T. In this link, passive components such as MLCCs (Multi-Layer Ceramic Capacitors) may seem tiny, but they are a critical link in determining signal integrity and system reliability. On September 10, at the "Source of Intelligent Computing: 2026 Core Computing Power Innovation Summit and the 8th Hardcore Core Award Ceremony" co-hosted by Xinshiye and IICIE (Internati
September 17, 2026
Recently, "Hangjiashuo Third-Generation Semiconductors" noted that 3 more OBC manufacturers have adopted GaN technology. Combined with existing research, nearly 10 OBC manufacturers, including Inovance United Power, United Automotive Electronic Systems (UAES), ShinyPower, Schaeffler, Fute Technology, and Valeo, are now involved, indicating that the commercialization process is steadily accelerating. Focusing on the development trend of GaN in automotive power supplies and its application scale i
September 17, 2026
On September 15, the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) issued the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry" (hereinafter referred to as the "Plan"). As the top-level document guiding the high-quality development of China's electronic information manufacturing industry over the next five years, the "Plan" lists Integrated Circuits (ICs), advanced materials, wide band
September 16, 2026
From September 9 to 11, 2026, the IICIE International IC Innovation Expo (IC Innovation Expo) was held at the Shenzhen World Exhibition & Convention Center (Bao'an). Themed "Cross-boundary Integration, Full-chain Synergy, Building a Featured Chip Ecosystem Together", the event was co-located with CIOE China International Optoelectronic Expo and elexcon Shenzhen International Electronic & Embedded Exhibition. The three exhibitions combined featured a total exhibition area of 320,000 squar
September 16, 2026
On September 12, the 2026 Supplier Conference of Shenzhen Megmeet Electrical Co., Ltd. (Stock Code: 002851) was held in Changsha. "Expert Talk on 3rd Generation Semiconductors" observed that Megmeet mainly revealed two highlights at this conference: The procurement order amount for 2026 reached as high as CNY 8.3 billion, and the procurement volume is expected to reach CNY 25 billion by 2029, covering products such as SiC and GaN; Megmeet also announced the list of strategic partners, including
September 16, 2026
On September 15, the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry (MIIT Joint Regulation [2026] No. 216, dated September 10, 2026). Anchored on the goal of basically realizing new-type industrialization, the plan proposes that by 2030, the operating revenue of electronic information manufacturing enterprises above desi
September 16, 2026
Over the past two years, the global semiconductor industry's focus has been almost entirely on NVIDIA's GPUs, TSMC's (Taiwan Semiconductor Manufacturing Company) advanced process nodes, and the data center capital expenditures of tech giants, which often reach tens of billions of US dollars. From the continuation of Moore's Law to breakthroughs in shrinking process nodes, the entire industry seems to be cheering for the geometric growth in the number of transistors. Data Source: MIR DATABANK Fro
September 16, 2026
Since September, Murata Manufacturing, the global leader in MLCCs, has taken two seemingly contradictory actions: planning a substantial capacity expansion for high-end MLCCs used in AI servers on one hand, and announcing the production halt of certain consumer and automotive MLCC part numbers on the other. Industry observers believe this does not reflect strategic wavering at Murata, but rather a reallocation of resources—shifting limited capacity away from traditional markets characterized by
September 16, 2026
Recently, Unigroup Guoxin Microelectronics (stock code: 002049) completed the update of its reply to the first round of inquiry letters from the Shenzhen Stock Exchange (SZSE) regarding the acquisition of WeEn Semiconductor. The company also intensively disclosed multiple documents, further publicizing the acquisition plan and the revenue progress of WeEn Semiconductor, indicating that the acquisition case has entered the later stage of the SZSE's review and inquiry. According to public informat
September 15, 2026
Recently, two additional SiC module projects in China have accelerated their production launch, focusing on the production and packaging and testing of automotive-grade power modules: Jingneng Micro: The second phase of the Wenling automotive-grade SiC packaging and testing base project has entered the final sprint stage; Grecon Semi: The SiC power device project has officially broken ground, and 6 new SiC module packaging and testing lines will be built. Jingneng Micro: Wenling SiC Project Ente
September 15, 2026
In September, news of price hikes in the global semiconductor market continued to emerge. Texas Instruments, Qualcomm, Intel, and Renesas have successively announced price increases, covering categories such as analog, SoC (System on Chip), CPU, and power. Behind this round of price hikes are the supply and capacity divergence caused by AI (Artificial Intelligence), the advance stocking by channels to prevent future price increases after two years of inventory digestion, and the choice by enterp
September 15, 2026
Recently, leading IC distributors WPG Holdings and WT Holdings have sequentially released their revenue data for August 2026. Both companies maintained high single-month revenues, achieving significant year-over-year growth. Specifically, WPG Holdings reported an August revenue of approximately NTD 198.38 billion (all subsequent figures are in NTD), a year-over-year increase of 98.21%, marking its second-highest monthly revenue on record; WT Holdings reported an August revenue of approximately N
September 14, 2026
"In the future, the overall AI will see significant improvements driven by the synergy between algorithms and hardware-software co-optimization. Hardware might push the overall AI performance up by 30% to 40% at most, but the synergy between algorithms and hardware-software co-optimization will absolutely leave room for a 10x or even 100x improvement in the future," said Guo Weijun, Vice President of Marketing at MoXin AI Technology (Shenzhen) Co., Ltd., at the recently held ICDIA. Founded in 20
August 26, 2026
At the recently held ICDIA, Deng Junyong, Deputy General Manager of Juliang Technology, delivered a keynote speech titled "Where Should Simulation EDA Tools Go in the AI Era" and accepted interviews from multiple media outlets, including EEFocus. Founded in 2019, this domestic EDA company is striving to find its own position in the global EDA market dominated by giants. Deng Junyong, Deputy General Manager of Juliang Technology The AI Era: Opportunity or Trap? AI is profoundly transforming the l
August 26, 2026
"In the era of Agent AI, CPU processing latency accounts for approximately 50% to 90% of the end-to-end latency of the entire Agent workload." This figure, presented by Xiao Jun, Director of Ecosystem Cooperation at Theo End Computing (Nanjing) Technology Co., Ltd., at the recently held ICDIA (Integrated Circuit Design and Application Exhibition), highlights the new challenges that AI Agent workloads pose to CPUs. Xiao Jun, Director of Ecosystem Cooperation at Theo End Computing (Nanjing) Techno
August 26, 2026
Amid the rush of domestic AI chips toward large model training and cloud inference, Vimicro Technology has shifted its focus to the edge and endpoint, targeting "perception" and "security"—two domains that may appear less flashy but are rapidly becoming essential requirements. "Traditional GPUs certainly offer high performance, but they also consume massive power. How can you deploy them at the edge and endpoint? Edge and endpoint scenarios are typically complex environments rather than single,
August 26, 2026
As AI data centers, NEVs (New Energy Vehicles), and photovoltaic energy storage systems rapidly evolve toward high-voltage and high-power architectures, traditional 400V and 800V buses are progressively transitioning to 1200V and even 1500V. However, in the field of high-voltage main power conversion, engineers have long faced a dilemma where it is difficult to balance competing requirements. If traditional high-voltage silicon carbide (SiC) solutions are adopted, although the devices have suffi
August 18, 2026
Author: Fang Yuan In the summer of 2026, a historic extreme heatwave swept across the European continent. Temperatures in multiple countries, including France, Germany, and the United Kingdom, exceeded 40°C, with at least 101 million people in Europe exposed to temperatures above 35°C on June 28 alone. The high temperatures brought not only a public health crisis—according to the World Health Organization, over 1,300 heat-related deaths have occurred in Europe since June 21 alone—but also trigge
July 6, 2026