Power delivery in AI data centers requires stepping down the voltage from the grid to the chip in four stages, with different power devices used at each stage. The high-voltage end is the battleground for SiC (Silicon Carbide), the intermediate bus is contested between GaN (Gallium Nitride) and silicon-based super-junction MOSFETs, and the board-level low-voltage end relies on silicon-based shielded gate MOSFETs and analog PMICs (Power Management ICs). The voltage ratings across these four stage
August 31, 2026