On September 10, the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) jointly issued the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry" (MIIT Joint Regulation [2026] No. 216), which was released in a centralized manner from September 15 to 16. In this top-level document, which targets a revenue of over CNY 30 trillion for enterprises above designated size and an R&D intensity of 3.
September 17, 2026
zhangtongshe.com Covering all scenarios from low power consumption to entry-level high performance. Recently, the official website of the China Securities Regulatory Commission (CSRC) showed that Nuclei System Technology (Shanghai) Co., Ltd. (Nuclei) has initiated IPO tutoring, with China Merchants Securities as the tutoring institution. Previously, the company was listed on the Innovation Layer of the National Equities Exchange and Quotations (NEEQ) in August 2026 and completed a targeted fundr
September 15, 2026
Author | ZeR0 Editor | Mo Ying Core Intelligence reported on September 11 that today, Enflame Technology, a leading AI chip company in Shanghai, rang the bell to go public on the STAR Market. Its issue price was CNY 142.18 per share, and it opened up 188.37% today at CNY 410.00 per share. As of 9:35, its stock price had surged to a high of 234.08%, reaching CNY 475.00 per share, with a total market capitalization of CNY 204.4 billion. Founded in March 2018, Enflame Technology has independently d
September 14, 2026
On September 11, 2026, Shanghai Enflame Technology Co., Ltd. (referred to as "Enflame Technology", stock code "688801.SH"), a domestic cloud Artificial Intelligence (AI) chip manufacturer, was officially listed on the STAR Market of the Shanghai Stock Exchange. The opening price was CNY 410 per share, surging 188.37% compared to the issue price, with a market capitalization of CNY 176.444 billion. As of press time, the intraday stock price of Enflame Technology reached a high of CNY 468 per shar
September 14, 2026
On September 4, He Tingbo, President of Huawei's Semiconductor Business Department, published the third academic paper on "Tao's Law" on ChinaXiv, the preprint platform of the Chinese Academy of Sciences, titled "Will Huawei's Tao Chip Melt?". This time, instead of just talking among themselves, Huawei put a mass-produced chip ready for shipment on the table, using actual test data to directly address the most pointed external doubts: Will 3D stacking overheat the chip? 01. From Planar Integrati
September 14, 2026
Author: ICVIEWS Editorial Department Just now, Enflame Technology officially listed on the SSE STAR Market with an issue price of 142.18 RMB. As of press time, the intraday stock price reached 437 RMB, surging over 200%, with the market capitalization briefly exceeding 200 billion RMB. What is more worth a closer look than the first-day stock price is the list of names revealed in the strategic placement roster. Tencent, as Enflame's largest customer and long-term shareholder, continued to incre
September 14, 2026
Author: Jiu Lin Recently, Hygon, Cambricon, Moore Threads, Muxi Semiconductor, Biren Technology, and Tianshu Zhixin have sequentially disclosed their 2026 semi-annual reports. Enflame Technology, which was recently listed, also updated its data for the same period in its prospectus. The combined revenue of the seven companies in the first half of the year reached approximately CNY 21.46 billion, nearly double that of the same period last year. Revenue has surged across the board: Cambricon grew
September 14, 2026
On the Eve of Industrial Transformation: System Applications Driving the Reconstruction of EDA Over the past year, the most profound change in the global technology industry has occurred at the intersection of the physical world and digital intelligence. From the rapid iteration of embodied intelligence and the city-level deployment of autonomous driving, to various robots beginning to enter industrial and household scenarios, AI (Artificial Intelligence) is extending from virtual space to the p
August 28, 2026
As Moore's Law approaches its physical limits, advanced packaging and 3D stacking are becoming critical paths for sustaining chip performance improvements. According to market research firms, the global 2.5D and 3D IC packaging market is expected to reach $12.4 billion by 2026 and is projected to grow to $33 billion by 2034. The Chiplet market is also experiencing rapid growth, with its scale expected to reach $65.3 billion by 2026. However, the flip side of market enthusiasm is a sharp increase
August 27, 2026
The National Center for Technological Innovation in Integrated Circuit Design Automation (referred to as the "National Center for Technological Innovation in EDA" or "EDA National Innovation Center") was approved by the Ministry of Science and Technology on December 30, 2022. It is led by Southeast University and co-built with the Jiangbei New Area of Nanjing, leading domestic EDA enterprises, and research institutes. As the first and only national-level technological innovation center in the fi
August 26, 2026
In recent years, the deployment speed of self-developed AI (Artificial Intelligence) chips by cloud providers and large model developers has significantly accelerated. Overseas, OpenAI and Broadcom are collaborating to advance custom chip R&D, and self-developed chips from providers like Google and AWS have become primary computing infrastructure. Domestically, Baidu AI Cloud has lit up the Kunlun Xin P800 10,000-card cluster, Alibaba T-Head has released the Zhenwu M890, and ByteDance's self
August 26, 2026
AI is accelerating the EDA tool industry revolution from shallow waters and conceptual stages into deep waters. Discussions around "EDA + AI" used to focus on point-tool optimization or auxiliary enhancements. Today, the continuous evolution of large language models (LLMs) and the maturation of agentic technologies are driving this transformation toward a fundamental reconstruction of design methodologies. EDA vendors are accelerating their layouts, moving from embedding AI capabilities into too
August 18, 2026
