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  • The Memory Supercycle: Apple’s Uncapped NAND Contract Signals a Seller’s Market

    Recently, a rumor regarding flash memory has drawn market attention. According to reports cited by Jiemian News, Apple has recently signed a Long-Term Agreement (LTA) with a NAND flash memory supplier, with the specific supplier, volume, and pricing terms remaining undisclosed. Market insiders believe that Japan's Kioxia might be the counterparty. Other sources suggest the agreement could span 3 to 5 years and may not include a price cap, though these details have not been officially confirmed.

    September 14, 2026

    The Memory Supercycle: Apple’s Uncapped NAND Contract Signals a Seller’s Market
  • Research Report | Memory Contract Prices Continue to Surge, Estimated to Account for Up to 68% of Major CSPs' Capital Expenditure in 2027

    Aug. 25, 2026 Industry Insights According to TrendForce's latest memory industry research, to accelerate the construction of AI infrastructure, the capital expenditure of major global cloud service providers (CSPs) is projected to increase by 98% year-over-year in 2026 and grow by another 50% in 2027. This substantial growth is partly attributable to the sharp surge in memory contract prices and the strong growth in procurement demand. TrendForce estimates that the combined share of DRAM and NAN

    August 26, 2026

    Research Report | Memory Contract Prices Continue to Surge, Estimated to Account for Up to 68% of Major CSPs' Capital Expenditure in 2027
  • Memory Giants Unveil Latest Technology Roadmaps: Where is the Next Stop for HBM?

    The AI wave continues to sweep across the global semiconductor industry. As the core cornerstone of AI computing power, the technological development and breakthroughs of HBM directly concern the future AI competitive landscape. At the recently held Hot Chips 2026 conference, the three major memory giants—Samsung, SK Hynix, and Micron—appeared on the same stage, each unveiling their latest insights and technological directions in the HBM field. 01. Samsung Unveils zHBM: DRAM Stacked Directly on

    August 26, 2026

    Memory Giants Unveil Latest Technology Roadmaps: Where is the Next Stop for HBM?

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