I remember when I first disassembled the first-generation Xiaomi Air Pump, Xiaomi hadn't started making cars yet. Now, Xiaomi has launched two new energy vehicles, the SU7 and the YU7. Coincidentally, Xiaomi has also released the new-generation Air Pump 2 Pro. What a perfect opportunity! I must take it apart to see what changes have been made to its hardware solution.

Teardown
The disassembly process wasn't complicated. The overall structure of the Air Pump 2 Pro still uses a combination of clips and screws. The main hardware components revealed after direct disassembly are as follows, including: the air pump, a mechanical device where a motor drives a bearing for piston movement; the mainboard and battery. The battery is directly soldered onto the mainboard. Having had a battery explode when disassembling a power bank before, I have lingering fears, so I don't want to mess with this battery; I'll leave it attached to the mainboard.

First, let's look at the PCB mainboard. The right area has 5 mechanical buttons, which can be used as Start/Stop, Light, Mode Switch, and Pressure Setting buttons respectively. The left area of the PCB has an LED segment screen with corresponding function identifiers; the illuminated LEDs indicate the active function.

Let's focus on some key components on the PCB mainboard:
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JJMicro N-MOSFET, model JMSL0303A;
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Sytatek High and Low Side Gate Driver IC, model SA2103;
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CMSemicon Enhanced 1T 8051 Flash MCU, model CMS80F261B;
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CellWise Battery Protection IC, model CW1246;
Among these, the MCU from CMSemicon supports up to 48MHz peripheral operation and 24MHz core operation, widely used in fields like IoT smart homes, new energy, medical electronics, small appliances, motors, and industrial/commercial applications. The battery protection IC from CellWise supports 3~4 series lithium battery protection, including overcharge, over-discharge, charge/discharge overcurrent, wire breakage, temperature protection, and balancing functions, making it very suitable for applications like robot vacuum cleaners and power tools.
Additionally, the battery interface area on the PCB board includes a 2mΩ current sense resistor (R002) and a green component—a fuse marked with silk screen "F1".

The structure backing the PCB mainboard houses the air pump module, which has been removed. Also, within this structure is an array of bicolor LEDs (white & red) serving as an emergency light. The aluminum backside of the PCB aids in heat dissipation.
There is 1 microswitch for detecting and controlling power on/off. Its function is realized by the air hose nozzle being pulled out or inserted: pulled out powers it on, inserted powers it off. This design prevents accidental operation and is very user-friendly.

The battery used in the air pump is a lithium battery module from Jiangsu Tianpeng Power, with 3 cells, totaling 2500mAh capacity. At full charge, it can inflate roughly 3.5 tires, making it suitable for topping up tire pressure.

Finally, let's look at the air pump module, which includes the motor, a reduction gear structure, and the cylinder. The motor has a marking specifying DC11V 17000RPM. The model number is likely this string (ZT550SPH-611C), but I couldn't find specific manufacturer information. If anyone knows, please leave a comment and let us know. Besides the motor, there's the reduction gear structure and the cylinder. The actual inflation process involves the motor rotating, driving the reduction gears, which then drive the cylinder piston in a reciprocating motion to pump air. So, simply put, the stronger the motor performance and the higher the speed, the faster the corresponding inflation.
Summary
The above details the internal structure and hardware solution of the Xiaomi Air Pump 2 PRO after disassembly. Overall, the workmanship is excellent, and the structural layout is reasonable. The selection of hardware solutions is almost entirely domestic chips. This shows the extent of domestic chip substitution in such consumer electronics products—if not 100%, it's probably close to 80%~90%. The question now seems to be—when 100% domestic chip substitution is achieved, where will the future growth points for domestic chips come from? Through incremental growth? Continuous innovation? Or expanding overseas? Welcome to leave comments and discuss.
来源: 与非网,作者: 曹顺程,原文链接: https://www.eefocus.com/article/1953397.html
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