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Xiaomi Air Pump 2 PRO Teardown

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I remember when I first disassembled the first-generation Xiaomi Air Pump, Xiaomi hadn't started making cars yet. Now, Xiaomi has launched two new energy vehicles, the SU7 and the YU7. Coincidentally, Xiaomi has also released the new-generation Air Pump 2 Pro. What a perfect opportunity! I must take it apart to see what changes have been made to its hardware solution.

Teardown

The disassembly process wasn't complicated. The overall structure of the Air Pump 2 Pro still uses a combination of clips and screws. The main hardware components revealed after direct disassembly are as follows, including: the air pump, a mechanical device where a motor drives a bearing for piston movement; the mainboard and battery. The battery is directly soldered onto the mainboard. Having had a battery explode when disassembling a power bank before, I have lingering fears, so I don't want to mess with this battery; I'll leave it attached to the mainboard.
First, let's look at the PCB mainboard. The right area has 5 mechanical buttons, which can be used as Start/Stop, Light, Mode Switch, and Pressure Setting buttons respectively. The left area of the PCB has an LED segment screen with corresponding function identifiers; the illuminated LEDs indicate the active function.
Let's focus on some key components on the PCB mainboard:
  • JJMicro​ N-MOSFET, model JMSL0303A;
  • Sytatek​ High and Low Side Gate Driver IC, model SA2103;
  • CMSemicon​ Enhanced 1T 8051 Flash MCU, model CMS80F261B;
  • CellWise​ Battery Protection IC, model CW1246;
Among these, the MCU from CMSemicon​ supports up to 48MHz peripheral operation and 24MHz core operation, widely used in fields like IoT smart homes, new energy, medical electronics, small appliances, motors, and industrial/commercial applications. The battery protection IC from CellWise​ supports 3~4 series lithium battery protection, including overcharge, over-discharge, charge/discharge overcurrent, wire breakage, temperature protection, and balancing functions, making it very suitable for applications like robot vacuum cleaners and power tools.
Additionally, the battery interface area on the PCB board includes a 2mΩ current sense resistor (R002) and a green component—a fuse marked with silk screen "F1".
The structure backing the PCB mainboard houses the air pump module, which has been removed. Also, within this structure is an array of bicolor LEDs (white & red) serving as an emergency light. The aluminum backside of the PCB aids in heat dissipation.
There is 1 microswitch for detecting and controlling power on/off. Its function is realized by the air hose nozzle being pulled out or inserted: pulled out powers it on, inserted powers it off. This design prevents accidental operation and is very user-friendly.
The battery used in the air pump is a lithium battery module from Jiangsu Tianpeng Power, with 3 cells, totaling 2500mAh capacity. At full charge, it can inflate roughly 3.5 tires, making it suitable for topping up tire pressure.
Finally, let's look at the air pump module, which includes the motor, a reduction gear structure, and the cylinder. The motor has a marking specifying DC11V 17000RPM. The model number is likely this string (ZT550SPH-611C), but I couldn't find specific manufacturer information. If anyone knows, please leave a comment and let us know. Besides the motor, there's the reduction gear structure and the cylinder. The actual inflation process involves the motor rotating, driving the reduction gears, which then drive the cylinder piston in a reciprocating motion to pump air. So, simply put, the stronger the motor performance and the higher the speed, the faster the corresponding inflation.

Summary

The above details the internal structure and hardware solution of the Xiaomi Air Pump 2 PRO after disassembly. Overall, the workmanship is excellent, and the structural layout is reasonable. The selection of hardware solutions is almost entirely domestic chips. This shows the extent of domestic chip substitution in such consumer electronics products—if not 100%, it's probably close to 80%~90%. The question now seems to be—when 100% domestic chip substitution is achieved, where will the future growth points for domestic chips come from? Through incremental growth? Continuous innovation? Or expanding overseas? Welcome to leave comments and discuss.

来源: 与非网,作者: 曹顺程,原文链接: https://www.eefocus.com/article/1953397.html

小米

小米

小米科技有限责任公司(Xiaomi Corporation)成立于2010年3月3日,总部位于北京市海淀区安宁庄路小米科技园,创始人雷军 ,是一家主要从事智能手机、智能汽车、芯片、 物联网和生活消费产品研发和销售业务,提供互联网服务,以及从事投资业务的中国投资控股公司。也是消费级机器人及智能硬件供应商,产品包括CyberOne、扫地机器人。

小米科技有限责任公司(Xiaomi Corporation)成立于2010年3月3日,总部位于北京市海淀区安宁庄路小米科技园,创始人雷军 ,是一家主要从事智能手机、智能汽车、芯片、 物联网和生活消费产品研发和销售业务,提供互联网服务,以及从事投资业务的中国投资控股公司。也是消费级机器人及智能硬件供应商,产品包括CyberOne、扫地机器人。收起

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