消费电子和汽车电子的芯片要求区别

现在汽车电子的发展是相对落后于消费电子的，确实是要结果导向，也要抓住关键点，做个东西不仅仅要因循旧例，更要把每个设计和考虑点想清楚，把实验和验证的价值分清楚，因为形势不同了，时间成本和实验成本上，都需要一些额外的考虑把每笔花下去的钱能够体现出来。体现不出来，如果装在车上不出问题，质量可靠也行啊。

ZVEI 在汽车电子领域倒是做了很多的内容，这份材料是选自《Fact Sheet: Foundation Differences Automotive vs. Consumer Components》里面的内容偏向于介绍性，不过也是能把一些东西直观的显示出来，这个东西是涉及消费电子和汽车电子所用芯片，除了单纯的一个 AEQC 能反映出来的差异，供大家参考。

具体这 66 个内容如下：

第一部分芯片电子相关的部分：

1)Metal line Electromigration caused by current density

Increased metal width and distances for power rails larger than the semiconductor manufacturing (lithography) limitations. Implementation of specific stress patterns (Vbump) on critical lines (high current density).

2）TDDB (Time dependent Dielectric Break Down) - Metalization

Spacing between metal lines need to be increased due to chip electrical field. For high voltage devices consider the application of stress patterns to detect weak oxide (see stress test in test chapter).

3）TDDB - Transistor Gate oxide Lifetime

Overdrive voltage can not be used to boost performance due to negative impact on reliability.

4）Transistor Aging to have margin for Auto lifetime degradation

Additional guard banding is applied during timing closure & design signoff process (NBTI and HCI) to ensure full performance of product at end of life. More complex analog circuit design.

第二部分封装

Reliability Requirements

In addition to AEC Q100/Q101 typically customer specific requirements apply.

Interaction Chip/Package

"Check regarding delamination (criteria may exceed standard JEDEC values).Other failure modes (e.g. ratcheting, fatigue) are to be checked over lifetime."

Wire bond integrity (Gold, Cu, etc)

Wire bond integrity evaluated through wire pull and ball shear strength as well as electrical test. Metal system validation supported by extensive studies according mission profile (high temp) .

Mold compound

For AECQ100 Grade 0/Grade 1 requirements mold compound may be optimized for better temperature and chemical capability incl. moisture ingress.

Board level reliability

High temperature and high temperature cycling requirements. Customer requirements are increasing significantly.

第三部分设计方法

第四部分供应商开发能力