Describes design technique where device loading admittances are taken directly from device design curves.
Describes design technique where device loading admittances are taken directly from device design curves.
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
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52929-1 | 1 | TE Connectivity | PIDG SP SPD 22-16COMM22-18MIL6 |
ECAD模型 下载ECAD模型 |
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$0.21 | 查看 | |
1206GC102KAT1A | 1 | Kyocera AVX Components | Capacitor, Ceramic, Chip, General Purpose, 1000pF, 2000V, ±10%, X7R, 1206 (3216 mm), 0.060"T, Sn/NiBar, -55º ~ +125ºC, 7" Reel |
ECAD模型 下载ECAD模型 |
|
$0.31 | 查看 | |
LQH3NPZ100MGRL | 1 | Murata Manufacturing Co Ltd | General Purpose Inductor, |
ECAD模型 下载ECAD模型 |
|
$0.68 | 查看 |
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