plastic, thermally enhanced very thin quad; flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body

2023/04/25 作者：恩智浦

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plastic, thermally enhanced very thin quad; flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body

plastic, thermally enhanced very thin quad flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body SOT619-18 plastic, thermally enhanced very thin quad flat non-leaded package

原创声明：本文为恩智浦原创内容，未经书面授权，不得以任何方式加以使用。转载合作

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恩智浦NXP主要提供MCU、MPU、SoC、汽车处理器、连接芯片，核心产品/技术包括Kinetis MCU；在低空经济产业链中覆盖安全芯片、存储与接口芯片、计算与控制芯片、模拟与电源芯片。

恩智浦NXP主要提供MCU、MPU、SoC、汽车处理器、连接芯片，核心产品/技术包括Kinetis MCU；在低空经济产业链中覆盖安全芯片、存储与接口芯片、计算与控制芯片、模拟与电源芯片。收起

plastic, thermally enhanced very thin quad; flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body

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