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SL3ICS3001_bumped wafer add_070730.fm 1. General description The SL3ICS3001FW is a contactless tag IC designed for tags and labels for RFID and AIDC system applications. This specification describes
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扫码加入Data sheet addendum; SL3ICS3001 UCODE HSL bumped wafer specification
SL3ICS3001_bumped wafer add_070730.fm 1. General description The SL3ICS3001FW is a contactless tag IC designed for tags and labels for RFID and AIDC system applications. This specification describes
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