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Summarize EDA in one sentence

2023/12/25
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EDA is the abbreviation of Electronic Design Automation, developed from concepts such as computer-aided design (CAD), computer-aided manufacturing (CAM), computer-aided testing (CAT) and computer-aided engineering (CAE).

Using computers as tools, designers use hardware description languages or schematic diagrams to input design files on the EDA software platform, and then the computer automatically completes logic compilation, synthesis, optimization, layout, Routing and simulation, and finally generates graphics that can be used for production.

These graphics that can be used for production are made into various masks, and various patterns are produced on different materials such as semiconductors, metal conductors, and insulating media through photolithography and other processes, and these patterns are combined together through technical means. Chips, packages, PCBs, etc. are formed to create electronic devices such as mobile phones and computers.

The emergence of EDA technology has greatly improved the efficiency and operability of circuit design, reduced the labor intensity of designers, and completed difficult tasks that were once unimaginable.

Using EDA tools, designers can design electronic systems starting from concepts, algorithms, protocols, etc.

A large amount of work can be completed by computers, and the entire process of electronic products from circuit design, performance analysis to IC, Package or PCB layout can be processed with computer assistance.

EDA is “The Mother of IC Chips" and the upstream industry of electronic design.

The EDA market worth tens of billions of dollars alone forms the foundation of the entire electronics industry. Whoever masters EDA will have dominance in the IC field.

EDA software is as important as lithography machines to IC industry. One is used for design and the other is used for manufacturing. Both are indispensable.Finally, we use one sentence to highly summarize EDA technology: EDA turns designers' ideas into manufacturable graphics.

Author's Book

The book "MicroSystem Based on SiP Technology" covers three parts: "Concept and Technology", "Design and Simulation", "Project and Case". It contains 30 chapters, with a total of about 1.1 million+ words, 1000+ illustrations, and about 890 pages.

This book is recommended for readers who are concerned about SiP, Advanced Packaging, Microsystem, and product miniaturization, low power consumption and high performance.

Articles of the Author:

    • Scales and Dimensions of IntegrationLevels and Steps of IntegrationHistory and Future of Integration

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0878321420 1 Molex Board Connector, 14 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

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501571-4007 1 Molex Board Connector, 40 Contact(s), 2 Row(s), Male, Right Angle, 0.039 inch Pitch, Surface Mount Terminal, Locking, Natural Insulator, Receptacle, LEAD FREE

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N2520-6002-RB 1 3M Interconnect Board Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle, ROHS COMPLIANT

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电子产业图谱

SiP技术专家,参与指导各类SiP与先进封装项目40多项;已出版技术著作3部:《基于SiP技术的微系统》PHEI 2021,《SiP System-in-Package Design and Simulation》(英文版)WILEY 2017,《SiP系统级封装设计与仿真》PHEI 2012;曾在中国科学院、SIEMENS工作,参与中国载人航天“神舟”飞船及中欧合作“双星”项目,现在奥肯思科技工作。公众号:SiP与先进封装技术。