Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height (mm) Pitch (mm) NXP TI Fairchild ON Toshiba MicroPak 0.8 x 0.8 x 0.35 0.5 GX MicroPak 1.0 x 0.9 x 0.35
Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height (mm) Pitch (mm) NXP TI Fairchild ON Toshiba MicroPak 0.8 x 0.8 x 0.35 0.5 GX MicroPak 1.0 x 0.9 x 0.35
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
---|---|---|---|---|---|---|---|---|
165566-1 | 1 | TE Connectivity | (165566-1) 110 PIDG FASTON REC |
ECAD模型 下载ECAD模型 |
|
$0.93 | 查看 | |
CRCW0603100RFKTA | 1 | Vishay Intertechnologies | RESISTOR, METAL GLAZE/THICK FILM, 0.1W, 1%, 100ppm, 100ohm, SURFACE MOUNT, 0603, CHIP, LEAD/HALOGEN FREE |
ECAD模型 下载ECAD模型 |
|
$0.11 | 查看 | |
MMBT3906-7-F | 1 | Diodes Incorporated | Small Signal Bipolar Transistor, 0.2A I(C), 40V V(BR)CEO, 1-Element, PNP, Silicon, GREEN, PLASTIC PACKAGE-3 |
ECAD模型 下载ECAD模型 |
|
$0.13 | 查看 |
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