This design checklist describes the generally recommended connections for new designs based on the NXP MPC8313E and MPC8313 processors. The design checklist may also apply to future bus or footprint
This design checklist describes the generally recommended connections for new designs based on the NXP MPC8313E and MPC8313 processors. The design checklist may also apply to future bus or footprint
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
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74737-0010 | 1 | Molex | Connector Accessory, Cage Assembly, Copper Alloy, LOW HALOGEN, ROHS AND REACH COMPLIANT |
ECAD模型 下载ECAD模型 |
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$3.28 | 查看 | |
TMK325ABJ476MM-P | 1 | TAIYO YUDEN | Capacitor, Ceramic, Chip, General Purpose, 47uF, 25V, ±20%, X5R, 1210 (3225 mm), 0.098"T, -55º ~ +85ºC, 7" Reel/4mm pitch/1K per reel |
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|
$0.77 | 查看 | |
BT137S-600,118 | 1 | WeEn Semiconductor Co Ltd | 4 Quadrant Logic Level TRIAC, 600V V(DRM), 8A I(T)RMS, TO-252AA, PLASTIC, SC-63, TO-252, DPAK-3/2 |
ECAD模型 下载ECAD模型 |
|
$0.74 | 查看 |
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