SOT1887-3 SOT1887-3 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 10 January 2018 Package information 1. Package summary Terminal position code B
SOT1887-3 SOT1887-3 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 10 January 2018 Package information 1. Package summary Terminal position code B
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
---|---|---|---|---|---|---|---|---|
MMBT3904,215 | 1 | Nexperia | MMBT3904 - 40 V, 200 mA NPN switching transistor@en-us TO-236 3-Pin |
ECAD模型 下载ECAD模型 |
|
$0.11 | 查看 | |
16-02-0069 | 1 | Molex | Wire Terminal, |
|
|
$0.05 | 查看 | |
IHLP1212BZER2R2M11 | 1 | Vishay Intertechnologies | General Fixed Inductor, 1 ELEMENT, 2.2 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 1212, HALOGEN FREE AND ROHS COMPLIANT |
ECAD模型 下载ECAD模型 |
|
$1.39 | 查看 |
01/22 09:54
01/22 09:50
01/22 09:27
01/22 09:24
01/22 09:21
01/16 10:43
01/10 14:26
01/09 18:37
01/08 18:39
01/08 18:34
01/08 18:31
01/08 18:26
01/08 17:56
01/05 14:15
01/05 14:06
01/05 13:59
01/05 13:48
01/05 13:45
01/05 13:41
01/05 13:39