芯耀
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CSEAC 2026 规模新高：7万平方米，联动1400+海内外展商，同期20+专业论坛、多场圆桌对话、新品发布……校企专区120+产业链企业、知名高校、科研院所集中亮相，汇聚芯成果，链接芯机遇！
- 海外展商占比超20%，国际化阵容再升级
- 200+演讲大咖集结，行业关切一次聊透
- 上下游“面对面”，供需对接一步到位
- 设备&部件创新大赛，见证人气产品加冕
- 中微新品重磅首发，硬核技术抢先看
- 风米人力行—高校成果路演+企业人才招聘
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- 预登记抽大奖，打卡二楼展位还有惊喜
△ 长按识别/扫描上方二维码，免费报名 △
CEPEA 主论坛
工业协会半导体设备年会
The 14th (2026) CEPEA Semiconductor Equipment Annual Conference
September 1st, 09:30–17:00
地点：无锡太湖国际博览中心中心A4馆
Hall A4, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Seminar on Etching Technology, Processes and Equipment
September 1st, 09:30-12:00
地点：无锡太湖国际博览中心A6馆
Hall A6, Taihu International Expo Center, Wuxi, China
Seminar on Thin-Film Deposition Technology, Processes and Equipment
September 1st,13:30-17:10
地点：无锡太湖国际博览中心A6馆
Hall A6, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Seminar on Measurement Technology and Equipment
September 1st, 13:25-17:00
地点：无锡太湖国际博览中心B4馆
Hall B4, Taihu International Expo Center, Wuxi, China
Seminar on Advanced‑Process Cleaning Technology and Equipment
September 1st, 09:30-11:35
地点：无锡太湖国际博览中心B4馆
Hall B4, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment
September 1st, 09:30-11:50
地点：无锡君来世尊酒店梅花厅
Plum Blossom Hall,Wuxi Junlai World Hotel
*议程持续更新中，请以现场实际为准
Seminar on Advanced Bonding Technology, Processes and Equipment
August 31st, 09:30-12:00
地点：无锡太湖国际博览中心B6馆
Hall B6, Taihu International Expo Center, Wuxi, China
Semiconductor Industry CEO Forum
August 31st, 09:45-17:05
地点：无锡太湖国际博览中心A4馆
Hall A4, Taihu International Expo Center, Wuxi, China
Path to Sovereign Semiconductor Manufacturing
August 31st, 09:30-11:30
地点：无锡太湖国际博览中心B4馆
Hall B4, Taihu International Expo Center, Wuxi, China
Forum on New Devices and Processes Driving Innovation and Development of New Materials and Equipment
August 31st, 13:30-17:00
地点：无锡太湖国际博览中心B4馆
Hall B4, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts (Part I)
August 31st, 09:20-12:00
地点：无锡太湖国际博览中心B6馆-1
Hall B6-1, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts (Part II)
September 1st, 13:30-16:50
地点：无锡太湖国际博览中心B6馆-1
Hall B6-1, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
2026 Integrated Circuit Materials, Equipment & Components Collaborative Development Forum
August 31st, 14:00-17:00
地点：无锡太湖国际博览中心A6馆
Hall A6, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
2026 Semiconductor Materials Development Forum（Wuxi）
August 31st, 09:30-12:00
地点：无锡太湖国际博览中心A6馆
Hall A6, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Xidian University Integrated Circuit Industry Alumni Taihu Forum
August 31st, 14:00-17:00
地点：无锡君来世尊酒店梅花厅
Plum Hall, Worldhotel Grand Juna Wuxi
*议程持续更新中，请以现场实际为准
New Product and Technology Launch
September 1st, 09:30-15:30
地点：无锡太湖国际博览中心B6馆
Hall B6, Taihu International Expo Center, Wuxi, China
AMEC New Product Launch Conference
September 1st, 14:00-15:30
地点：无锡君来世尊酒店 二楼会议室8
Meeting Room 8, 2F, World Hotel Grand Juna Wuxi
现场将发布刻蚀、薄膜、MOCVD等多款高端设备，
诚邀您莅临交流！
Human Resources: Thematic Conference on Corporate Talent Demand Release
August 31st, 13:00-15:10
地点：无锡太湖国际博览中心B6-1馆
Hall B6-1, Taihu International Expo Center, Wuxi, China
*议程持续更新中，请以现场实际为准
Human Resources: Thematic Roadshow on the Commercialization of University-Industry Research Collaboration
September 1st, 09:30-17:00
地点：无锡太湖国际博览中心 B6-2馆
Hall B6-2, Taihu International Expo Center, Wuxi, China
The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum
September 1st, 09:00-11:35
地点：无锡君来世尊酒店兰花厅
The Orchid Hall, World Hotel Grand Juna Wuxi
*议程持续更新中，请以现场实际为准
Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
August 31st, 13:30-16:30
地点：无锡君来世尊酒店兰花厅
The Orchid Hall ,World Hotel Grand Juna Wuxi
*议程持续更新中，请以现场实际为准
Forum on the Innovation in Packaging and Testing Equipment and Materials
August 31st, 09:20-12:00
地点：无锡君来世尊酒店兰花厅
The Orchid Hall ,World Hotel Grand Juna Wuxi
*议程持续更新中，请以现场实际为准
Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era
September 1st, 13:25-16:30
地点：无锡君来世尊酒店兰花厅
The Orchid Hall, World Hotel Grand Juna Wuxi
8月31日-9月2日，携手见证
这场年度性中国半导体盛宴
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