芯耀
与非AI
145
人工智能和数据中心 - 数据中心及 AI 数据中心解决方案 - 服务器机架电源管理 - 服务器电源解决方案
概述
英飞凌端到端服务器电源解决方案采用混合Si、SiC、GaN器件组合，专为现代AI数据中心设计。该方案可实现高达97.5%的峰值效率，并借助高频LLC和无桥PFC等拓扑结构实现紧凑的系统设计。依托全球制造能力和贯穿产品生命周期的“零缺陷”理念，英飞凌为高密度AI数据中心提供可靠、可扩展且节省空间的服务器电源设计。
产品优势
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端到端服务器电源解决方案
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全面的多技术产品组合
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采用GaN与SiC实现最优性能
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搭配CoolSiC™的无桥PFC
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采用CoolGaN™的高频LLC
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高密度服务器电源设计
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高达97.5%的峰值效率
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宽输入/输出功率范围
文档：User manual
KIT-CYW55310-EVAL Evaluation Kit User Guide
AIROC CYW55310 Bluetooth® Audio Development Kit
文档：Application note
CoolSiC™ totem-pole PFC design guide and power loss modeling
Optimizing PCB layout for CoolGaN™ power transistors in SMPS applications
Optimizing PCB layout for HV CoolGaN™ power transistors
Part I: LLC calculator
FHA Analysis based on a vector algorithm
CoolSiC™ MOSFET 650 V M1 trench power device Infineon’s first 650 V silicon carbide MOSFET for industrial applications
Due to the worldwide increase in power consumption it is necessary to design power supplies that offer the highest possible efficiency during standard operating conditions. This application note will first give an overview covering the technological parameters of Infineon’s first 650 V SiC trench MOSFET. Second, it will provide benchmarking results based on characterization data, and in target applications against competitors. Finally, it will provide design guidelines for implementing SiC in the target applications.
Part II: Using the LLC calculator with rules of thumb (ROT) and fast verification with LTspice
A guide for adapting the LLC calculator to design rules based on exact mode analysis of LLC converter
Design guide PFC CCM boost converter
Design guide Gallium Nitride - CoolGaN™ totem-pole PFC power loss modeling
文档：文章
Designing a 30 kW 3-phase interleaved type Vienna PFC for AI Server Power Supply
Explore a practical blueprint for a 30 kW interleaved Vienna PFC stage that delivers high efficiency, unity power factor, and low THD for AI data center power trains. The paper details control methods, magnetics optimization, EMI compliance, and semiconductor choices to meet stringent performance and density targets.
Power Pulsating Buffer to meet peak power demands in AI server PSUs without disturbing the grid
Infineon’s Power Pulsating Buffer (PPB) technology offers an innovative solution to meet the rising power demands of AI server racks, which are expected to reach power levels of up to 1 MW. GPUs impose significant peak power requirements and high load transients, necessitating changes in AC and DC rack architectures. PPB stabilizes power delivery during these surges without overloading the grid, supporting efficient and sustainable AI server operations. Download the full article to learn more.
文档：白皮书
How Infineon Technologies' SiC solutions are shaping the future of data center power supplies
Efficient and high‑performance power solutions are essential for meeting the rising demands of AI‑driven data centers. Infineon drives innovation by leveraging the intrinsic advantages of silicon carbide (SiC) through its advanced CoolSiC™ MOSFET portfolio, enabling next‑generation power architectures and multi‑level topologies.
Download the full whitepaper to discover Infineon’s complete portfolio and market drivers shaping future power systems.
Scaling AI data center power delivery with Si Sic and GaN
Explore how SiC and GaN are redefining power-supply design to meet the growing demands of AI SoCs
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