This application note shows how to easily migrate the communication protocol C12.18 which is already implemented on the MCF51EM256 on to new devices.This is explained in the NXP application note
This application note shows how to easily migrate the communication protocol C12.18 which is already implemented on the MCF51EM256 on to new devices.This is explained in the NXP application note
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
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282836-4 | 1 | TE Connectivity | (282836-4) TERMI-BLOK PCB MOUNT 90 4P. |
ECAD模型 下载ECAD模型 |
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$1.68 | 查看 | |
C0805C104K5RAC7210 | 1 | KEMET Corporation | Capacitor, Ceramic, Chip, General Purpose, 0.1uF, 50V, ±10%, X7R, 0805 (2012 mm), -55º ~ +125ºC, 13" Reel/Unmarked |
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$0.02 | 查看 | |
GRM155R71C104KA88D | 1 | Murata Manufacturing Co Ltd | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT |
ECAD模型 下载ECAD模型 |
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$0.02 | 查看 |
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