SMT BGA制程工艺术语清单

1. AABUS: As Agreed Upon Between User
and Supplier
由供需双方协商确定

2. ASIC: Applications Specific IC
专用集成电路

3. ASM: Array Surface Mount
阵列表面贴装

4. ASMP: Application Specific Module Packaging
专用模块封装

5. AXI: Automatic X-Ray Inspection
自动X射线检查

6. BGA: Ball Grid Array
球栅阵列

7. BOC:  Board-On-Chip
芯片上板子直装

8. BT: Bismaleimide-Triazine
双马来酰亚胺三嗪

9. CAGE: Commercial and Government Entity
商业及政府机构

10. CBGA: Ceramic Ball Grid Array
陶瓷球栅阵列

11. CCGA: Ceramic Column Grid Array
陶瓷柱栅阵列

12. CGA: Column Grid Array
柱栅阵列

13. COB: Chip-On-Board
板上芯片直装

14. CPU: Central Processing Unit
中央处理器

15. CSP: Chip Scale Packages
芯片尺寸封装

16. CTE: Coefficient of Thermal Expansion
热膨胀系数

17. CTF: Critical To Function
关键功能

18. DBDPE: Decabromodiphenyl Ether
十溴联苯醚

19.DDR-SDRAM：Double-Data-Rate Synchronous
Dynamic Random Access Memory
双倍速率同步动态随机存取存储器

20.Df:  Dissipation Factor
损耗因子

21.DfM: Design for Manufacturability
可制造性设计

22.DfR:  Design for Reliability
可靠性设计

23. DIG:  Direct Immersion Gold
直接浸金

24. Dk: Dielectric Constant
介电常数

25. DMA: Dynamic Mechanical Analysis
动态力学分析

26. DSBGA: Die-Size Ball Grid Array
芯片尺寸球栅阵列

27. DSC:  Differential Scanning Calorimetry
差分扫描热量测定法

28. DSP: Die Size Package
芯片尺寸封装

29. dT:  Temperature Differential
温差

30. ECM: Electrochemical Migration Test
电化学迁移测试

31. ENEPIG:  Electroless Nickel/Electroless
Palladium/Immersion Gold
化学镀镍/化学镀钯/浸金

32. ENIG:  Electroless Nickel Immersion Gold
化学镀镍浸金

33. ESD:  Electrostatic Discharge/
Electrostatic Device
静电放电/静电装置

34. ESS：Environmental Stress Screening
环境应力筛选

35. EU:  European Union
欧盟

36. FAT:  Flux Activation Time
助焊剂活化时间

37. FBGA: Fine Pitch Ball Grid Array
密节距球栅阵列

38. FC:  Flip Chip
倒装芯片

39. FPT:  Fine Pitch Technology
密节距技术

40. FRBGA:  Fine-Pitch, Rectangular Ball Grid Array
密节距,矩形球栅阵列

41. FT:  Functional Test
功能测试

42. GAC: Grid Array Component
格栅阵列器件

43. HASL:  Hot Air Solder Level
热风焊料整平

44. HAST:  Highly Accelerated Stress Testing
高加速应力测试

45. HCI:  Hydrochloric
氯化氢的

46. HDB:  High Density Printed Boards
高密度印制板

47. HF:  Hydrofluoric
氢氟酸的

48. HoP: Head-on-Pillow
枕头效应

49. I/O:  Input/Output
输入/输出

50. ICT:  In-Circuit Test
在线测试

51. ILC:  Independent Loading Mechanism
独立加载机构

52. IMC:  Intermetallic Compound
金属间化合物

53. IR:  Infrared
红外线

54. LCP:  Liquid Crystal Polymer
液晶聚合物

55. LFBGA: Low-Profile Fine-Pitch Ball Grid Array
小外形密节距球栅阵列

56. LMC:  Least Material Condition
最小实体条件

57. LTD: Liquidus Time Delay
液相时间延迟

58. MCM: Multichip Module
多芯片模块

59. MCM-L:  Multichip Module-Laminate
多芯片模块-层压板

60. MCP:  Multichip Package
多芯片封装

61. MD:  Metal Defined
金属限定

62. MDA:  Manufacturing Defect Analyzer
制造缺陷分析仪

63. MDS:  Multi Device Subassembly
多器件子组件

64. MLC:  Multilayer Ceramic
多层陶瓷

65. MMB:  Moisture Membrane Bag
湿薄膜袋

66. MMC:  Maximum Material Condition
最大实体条件

67. NAND: Not “And”
非“与”

68.NSMD:  Nonsolder Mask Defined
非阻焊膜限定

69. OEM:  Original Equipment Manufacturer
原始设备制造商

70. OSP:  Organic Solderability Preservative
有机可焊性保护剂

71. PBB:  Polybrominated Biphenyl
多溴化联苯

72. PBBO:  Polybrominated Biphenyl Oxide
多溴化联苯氧化物

73. PBDE:  Polybrominated Diphenyl Ether
多溴二苯醚

74. PBGA: Plastic Ball Grid Array
塑封球栅阵列

75. PCA:  Printed Circuit Assembly
印制电路组件

76. PCB:  Printed Circuit Board
印制电路板

77. PCM:  Phase Change Materials
相变材料

78. PCMCIA:  Personal Computer Memory Card
International Association
个人计算机存储卡国际协会

79. PGA:  Pin Grid Array
针栅阵列

80. PLCC:  Plastic Leaded Chip Carrier
塑料有引线芯片载体

81. PSA:  Pressure Sensitive Adhesives
压敏粘合剂

82. PTH:  Plated Through-Hole
镀通孔

83. QFP:  Quad Flat Pack
方形扁平封装

84. RDS:  Rectangular Die Size
矩形芯片尺寸

85. RF:  Radio Frequency
射频

86. RFID:  Radio Frequency Identification
射频识别

87. RMS:  Root Mean, Square
均方根

88. RoHS: Restriction of Hazardous Substances
有害物质限制

89. RSS:  Ramp-Soak-Spike
升温-保温-峰值

90. RTS:  Ramp-to-Spike
升温至峰值

91. SAC:  Sn/Ag/Cu
锡/银/铜

92. SDRAM:  Synchronous Dynamic Random
Access Memory
同步动态随机访问存储器

93. SGA:  Solder Grid Array
焊料栅格阵列

94. SIR:  Surface Insulation Resistance
表面绝缘电阻

95. SMD:  Solder Mask Defined
阻焊膜限定

96. SMOBC: Solder Mask Over Bare Copper
裸铜覆阻焊膜

97. SMT:  Surface Mounting Technology
表面贴装技术

98. SO-DIMM: Small Outline Dual In-Line
Memory Module
小外形双列直插存储模块

99. SOIC:  Small Outline Integrated Circuit
小外形集成电路

100. SPC:  Statistical Process Control
统计过程控制

101. SRAM:  Static Random Access Memory
静态随机存取存储器

102. SSO:  Simultaneously Switching Output
同步开关输出

103. STII:  Soldering Temperature Impact Index
焊接温度影响指数

104. TAB:  Tape-Automated Bonding
载带自动键合

105. TAL:  Time Above Liquidus
液相线上时间

106. TBBPA:  Tetrabromobisphenol A
四溴双酚A

107. TBGA:  Tape Ball Grid Array
载带球栅阵列

108. Td:  Decomposition Temperature
分解温度

109. TFBGA:  Thin Profile Fine Pitch Ball Grid Array
薄外形细节距球栅阵列

110. Tg: Transition Temperature
转变温度

111. TIM:  Thermal Interface Materials
热界面材料

112. TMA:  Thermal Mechanical Analysis
热机械分析

113. UFPT:  Ultra Fine Pitch Technology
超密节距技术

114. UtRAM:  Uni-transistor Random Access Memory
单一晶体管随机存取存储器

115. UUT:  Unit Under Test
被测单元

116. UV:  Ultraviolet
紫外线

117. VFBGA:  Very Thin-Profile Fine-Pitch Ball
Grid Array
极薄外形细节距球栅阵列

118. WEEE:  Waste in Electrical and Electronic
Equipment
废弃电子电器设备

119. ZIF:  Zero Insertion Force
零插拔力