© 2011 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document
© 2011 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
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3-1447221-3 | 1 | TE Connectivity | S/S CONN REC CONTACT ASSEMBLY |
ECAD模型 下载ECAD模型 |
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GCM188R71H103KA37D | 1 | Murata Manufacturing Co Ltd | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
ECAD模型 下载ECAD模型 |
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$0.01 | 查看 | |
BSN18-3K | 1 | Panduit Corp | Wire Terminal, 1.5mm2, |
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暂无数据 | 查看 |
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