3 万美元一片！台积电 2nm 高价炸场，AMD 抢先上车

Note: The English version is provided below.

台积电在2nm制程研发上取得关键突破。根据最新数据显示，其2nm制程初始良率已达到64%-66%，SRAM良率更突破90%，显著领先于竞争对手三星电子的40%良率。这一技术优势为其2025年下半年试产和2026年量产奠定了坚实基础。

在产能规划方面，台积电计划初始月产能为3万至3.5万片晶圆，并通过四座新建晶圆厂在2026年将月产能提升至6万片。技术性能方面，2nm制程在相同功耗下性能提升10%-15%，或在相同性能下功耗降低20%-30%，这一提升对AI芯片和高效能运算领域具有重要价值。

市场策略上，台积电采取高价定位，每片晶圆定价3万美元，较3nm制程价格上涨50%以上。这一策略旨在优先满足苹果、英伟达、AMD等高端客户需求。值得注意的是，AMD已宣布将在2026年推出的处理器中率先采用2nm制程。

全球布局方面，台积电获得了多地政府支持，2025年上半年获得政府补助约160.3亿元人民币。这些资金支持了其在美国、日本、德国等地的工厂建设，其中美国亚利桑那州工厂将量产2nm及更先进制程。

与三星采取低价策略争夺市场相比，台积电通过技术优势和高端客户绑定，巩固了其在先进制程领域的领先地位。随着2nm制程的量产临近，台积电有望进一步扩大在高端芯片制造市场的竞争优势。

US$30,000 per wafer! TSMC’s 2nm pricing stuns the market, with AMD leading the adoption

TSMC has achieved a critical breakthrough in the development of its 2nm process. According to the latest data, the initial yield rate for its 2nm process has reached 64%-66%, with the SRAM yield rate exceeding 90%, significantly ahead of its competitor Samsung Electronics’ 40% yield rate. This technological advantage lays a solid foundation for trial production in the second half of 2025 and mass production in 2026.

In terms of production capacity planning, TSMC aims for an initial monthly capacity of 30,000 to 35,000 wafers, with plans to increase monthly capacity to 60,000 wafers by 2026 through four newly built wafer fabs. Technologically, the 2nm process offers a 10%-15% performance improvement at the same power consumption or a 20%-30% reduction in power consumption at the same performance level. This enhancement holds significant value for AI chips and high-performance computing applications.

In terms of market strategy, TSMC has adopted a premium pricing approach, setting the price per wafer at US$30,000, representing a more than 50% increase compared to the 3nm process. This strategy aims to prioritize meeting the demands of high-end customers such as Apple, NVIDIA, and AMD. Notably, AMD has announced that it will be among the first to adopt the 2nm process in processors set for release in 2026.

Regarding global expansion, TSMC has received government support in multiple regions, securing approximately RMB 16.03 billion in subsidies in the first half of 2025. These funds support the construction of its factories in the United States, Japan, Germany, and other locations, with the facility in Arizona, USA, set to mass-produce 2nm and more advanced processes.

Compared to Samsung’s strategy of competing for market share with lower prices, TSMC is consolidating its leading position in advanced processes through technological advantages and partnerships with high-end customers. With the mass production of the 2nm process approaching, TSMC is poised to further expand its competitive edge in the high-end chip manufacturing market.