Huawei AITO T-BOX Teardown

This time, we plan to tear down a T-BOX component from an AITO M7. Since the T-BOX includes wireless communication and a full metal shell would shield signals, the ones seen on the market basically use plastic shells.

Teardown

After disassembly, there is only one PCB inside.

SanDisk eMMC flash memory chip, model SDINBDE2-4G, mainly used for storing the operating system, communication firmware, and vehicle temporary cache data.

Renesas 32-bit automotive-grade microcontroller, model R7F7010453AFP, mainly responsible for the internal basic logic and peripheral control of the T-BOX.

Texas Instruments Class-D stereo audio amplifier, model TPA3136D2, used for audio output and sound amplification.

Fujitsu signal relay, model FTR-B3GA003Z-B10.

The wireless communication module is a small PCB board in LGA package mounted on the main PCB. It includes the HiSilicon family solution (excluding storage):

Elite Semiconductor SDRAM, model EM6BD4D2GXA, provides temporary runtime space for T-BOX data processing, working with the eMMC flash to form a complete storage-memory subsystem.
HiSilicon 4G LTE baseband chip, model Hi2152, handles all cellular network protocols and is the core for remote control, OTA updates, and data upload.
HiSilicon power management chip, model Hi6559, as the companion PMIC, provides power distribution and power-on sequencing for the Hi2152 baseband and its peripheral circuits.
HiSilicon 4G LTE multi-mode RF transceiver chip, model Hi6361, sits between the baseband and the RF front-end, converting digital signals to analog RF signals and vice versa for reception and demodulation.
HiSilicon low-band power amplifier, model Hi6D13, specifically amplifies low-band 4G signals.
HiSilicon mid/high-band power amplifier, model Hi6D03, amplifies mid- and high-band 4G signals.
HiSilicon RF front-end chip, model Hi6D21, works with the PA chips above to form a complete domestic RF transmit chain.

As you can see, from baseband to power management, to RF transceiver and RF front-end, HiSilicon provides a complete communication chipset solution. This kind of "packaged" in-house capability is rare in today's automotive supply chain.

Texas Instruments boost DC/DC converter, model TPS61086DRCR.

Texas Instruments 8-bit dual-supply bus transceiver, model SN74AVC8T245, used for signal level translation between chips operating at different voltage domains.

Asahi Kasei Microdevices audio codec, model AK4940VN, responsible for voice signal capture and decoding.

Littelfuse TVS diode, model SA30CA, used for suppressing surges and ESD on power lines.

Realtek Ethernet physical layer transceiver, model RTL9000AN. As in-vehicle networks evolve toward Ethernet, the T-BOX uses this chip to connect to the automotive Ethernet backbone, enabling high-speed data exchange with the central console and ADAS domain controller.

NXP high-speed CAN transceiver, model TJA1145T, supports CAN FD protocol. It is the physical-layer interface for data exchange between the T-BOX and traditional vehicle CAN buses (such as body control, battery management, etc.).

u-blox automotive-grade GNSS receiver chip, model UBX-M8030-KT, is the core for positioning in this T-BOX. It can simultaneously receive signals from GPS, BeiDou, GLONASS, and Galileo, providing precise position, velocity, and time information for navigation, remote vehicle control, and emergency call scenarios.

Summary

The above are the main components in the AITO M7 T-BOX solution. On the most critical 4G communication link, HiSilicon provides a complete solution covering baseband, power management, RF transceiver, and RF front-end power amplifiers. Chips from other major international vendors mainly handle auxiliary functions such as control, storage, interface conversion, and protection.