The LFPAK33 brings NXP’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint
The LFPAK33 brings NXP’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
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XEB1202 | 1 | Okaya Electric America Inc | RC Network, |
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$5.38 | 查看 | |
MBR0530 | 1 | Vishay Intertechnologies | Rectifier Diode, Schottky, 1 Element, 0.5A, 30V V(RRM), Silicon, PLASTIC PACKAGE-2 |
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$0.34 | 查看 | |
BSS138BKW,115 | 1 | NXP Semiconductors | BSS138BKW - 60 V, 320 mA N-channel Trench MOSFET SC-70 3-Pin |
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$0.24 | 查看 |
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