This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.
This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
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BAV99-E3-08 | 1 | Vishay Intertechnologies | Rectifier Diode, 2 Element, 0.15A, 70V V(RRM), Silicon, ROHS COMPLIANT PACKAGE-3 |
ECAD模型 下载ECAD模型 |
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$0.17 | 查看 | |
IHLP2525CZER8R2M01 | 1 | Vishay Intertechnologies | General Fixed Inductor, 1 ELEMENT, 8.2 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2525, GREEN |
ECAD模型 下载ECAD模型 |
|
$1.01 | 查看 | |
15305288 | 1 | Delphi Automotive LLP | Wire Terminal |
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$0.84 | 查看 |
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